News
SAN JOSE – With 155 billion ICs produced, the value of the worldwide IC packaging market was $32.7 billion in 2008, reports Electronic Trend Publications.
BERLIN – The global semiconductor market is expected to decline 21.6% on an annualized basis to $194.8 billion in 2009, according to World Semiconductor Trade Statistics.
ST. PAUL, MN – SUSS MicroTec will distribute 3M’s wafer support system equipment for temporary wafer bonding of ultrathin wafers required for 3-D packaging.
Press Releases
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- Naprotek Appoints James Eisenhaure as Chief Financial Officer
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- Incap UK achieves JOSCAR Zero accreditation – Strengthens its position in the defence and aerospace sector