News
SAN JOSE – The US Patent and Trademark Office issued an office action confirming the rejections of all claims of a Tessera Technologies Inc. patent in ex parte reexamination. The patent office previously rejected these claims in an earlier action.
The patent relates to semiconductor packaging technologies used in a variety of applications.
The patent relates to semiconductor packaging technologies used in a variety of applications.
The provider of miniaturization technologies is asserting the ‘326 patent in two investigations pending in the U.S. International Trade Commission against a number of companies. The first of those actions was completed July 18. The second action is scheduled for a 7-day hearing to begin on February 5.
DURHAM, NC – EMS provider Sanmina-SCI Corp. has been awarded a manufacturing services agreement for production of Parata System's pharmacy automation solutions: Parata Max and Parata Mini.
Production is set to occur at Sanmina’s Medical Division facilities in the Research Triangle Park area of Durham, NC. Parata is also based in Durham.
No financial terms of the agreement were disclosed.
ARLINGTON, VA – The Defense Advanced Research Projects Agency provided Northrop Grumman's Electronic Systems a $1.7 million contract to develop an ultra high capacity hybrid thermal ground plane to fight semiconductor-generated heat employed in electronic systems.
The 18-month contract follows a $1.5 million contract awarded earlier this year to the University of Colorado, Boulder and Lockheed Martin to work on comparable technology.
Together, both contracts eventually could be worth about $10 million, says the agency, provided all phases are completed.
These agreements come on the heels of a recent Navy report predicting shipboard cooling requirements would double every six years for the next 20 years.
