SHENZHEN – The SMTA China Chapter, in conjunction with the NepconSouth China trade show producers, will sponsor the conference program Aug. 24 – 30, in Shenzhen.
The event will address electronics manufacturing, advanced packaging and Pb-free reliability. Topics will range from 01005 assembly and state-of-the-art inspection and failure analysis to market trends and cost reduction initiatives.
The premiere Nepcon Best Engineer award also will be announced during the event. Engineers can nominate themselves, or companies can recommend candidates through Reed Exhibitions China.
For more information about the SMTA conference and Best Engineer award, visit www.nepconchina.com.
LAS VEGAS – IPC is requesting abstracts for Apex, which will take place March 31-April 2 in Las Vegas.
Expert presentations are being sought on all relevant design, PCB fabrication and manufacturing topics. Submissions in the areas of new materials and environmental concerns are encouraged. The committee will choose abstracts that describe significant results from experiments, emphasize new techniques or discuss trends and test results.
BRIDGEWATER, MA – Chase Corp. today reported net income of $3.2 million for its May quarter, up 12% over last year. Revenues fell 2% to $33.9 million from the prior year period.