News
SURREY, UK – TT Electronics Plc reported year-to-date operating profits were down year-over-year on lower demand at its sensors and electronic systems, and electronic components business units. Specific numbers were not provided.
The company cited lower production in the automotive sector, where demand is expected to be off in the fourth quarter as well.
Electronic manufacturing services demand will remain in line with expectations, TT Electronics said.
The company expects to take a £5.3 million fourth-quarter charge related to the July closing of a South Wales plant and the proposed relocation of AB Electronic in Romford, UK, to China and India.
The company cited lower production in the automotive sector, where demand is expected to be off in the fourth quarter as well.
Electronic manufacturing services demand will remain in line with expectations, TT Electronics said.
The company expects to take a £5.3 million fourth-quarter charge related to the July closing of a South Wales plant and the proposed relocation of AB Electronic in Romford, UK, to China and India.
ANGLETON, TX – Benchmark Electronics reported sales fell 4.6% to $642 million in the September quarter from the prior year. Net income was $24 million, up 9% over last year.
SAN JOSE – The MicroElectronics Packaging and Test Engineering Council (MEPTEC) released the program for its Nov. 13 symposium “Packaging Developments and Innovations: From System Design to Integrated Delivery” in San Jose.
Glenn Daves, director of packaging technology at Freescale Semiconductors will keynote, discussing aligning packaging developments with the market.
Sessions include advanced packages and processes; packaging to board assembly trends; microelectronics substrate fabrication and assembly innovation, and design tools and co-design solutions.
To register, visit www.meptec.org.
Glenn Daves, director of packaging technology at Freescale Semiconductors will keynote, discussing aligning packaging developments with the market.
Sessions include advanced packages and processes; packaging to board assembly trends; microelectronics substrate fabrication and assembly innovation, and design tools and co-design solutions.
To register, visit www.meptec.org.
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