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SAN JOSE – The MicroElectronics Packaging and Test Engineering Council (MEPTEC) released the program for its Nov. 13 symposium “Packaging Developments and Innovations: From System Design to Integrated Delivery” in San Jose.
Glenn Daves, director of packaging technology at Freescale Semiconductors will keynote, discussing aligning packaging developments with the market.
Sessions include advanced packages and processes; packaging to board assembly trends; microelectronics substrate fabrication and assembly innovation, and design tools and co-design solutions.
To register, visit www.meptec.org.
Glenn Daves, director of packaging technology at Freescale Semiconductors will keynote, discussing aligning packaging developments with the market.
Sessions include advanced packages and processes; packaging to board assembly trends; microelectronics substrate fabrication and assembly innovation, and design tools and co-design solutions.
To register, visit www.meptec.org.
SAN JOSE –Flextronics today said its second-quarter net sales were $8.9 billion, up 59% year-over-year.
TORONTO – Celestica Inc. reported third-quarter revenue was $2.03 billion, down 2.4% year-over-year, in line with company guidance.
Net earnings were $32.1 million, down nearly 38% compared to the same quarter last year.
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