News
SAN JOSE – Freescale Semiconductors director of packaging technology Glenn Daves will keynote an upcoming MEPTEC symposium on packaging.
The symposium, Packaging Developments and Innovations: From System Design to Integrated Delivery, takes place Nov. 13 in San Jose.
In his presentation, Aligning of Packaging Development with the Market, Daves will discuss how the interplay of competing requirements and constrained schedules often makes market alignment a complex undertaking, and show examples of market requirements and the packages and technologies that resulted from the alignment process.
A second keynote, by Mike Crawley, will cover how to play a role in significant technological advances.
Other presentations include advanced packages and processes; packaging to board assembly trends; microelectronics substrate fabrication and assembly innovations, and design tools and co-design solutions.
To register, visit www.meptec.org.
The symposium, Packaging Developments and Innovations: From System Design to Integrated Delivery, takes place Nov. 13 in San Jose.
In his presentation, Aligning of Packaging Development with the Market, Daves will discuss how the interplay of competing requirements and constrained schedules often makes market alignment a complex undertaking, and show examples of market requirements and the packages and technologies that resulted from the alignment process.
A second keynote, by Mike Crawley, will cover how to play a role in significant technological advances.
Other presentations include advanced packages and processes; packaging to board assembly trends; microelectronics substrate fabrication and assembly innovations, and design tools and co-design solutions.
To register, visit www.meptec.org.
TUCSON, AZ – The ESD Association members elected to its board of directors Gianluca Boselli, Texas Instruments; Tom Larson, Trek Inc.; Michelle McSwain, TW Clean and consultant Steven H. Voldman.
The new board will serve for a three-year term beginning Jan. 1.
The board also elected its officers for a one-year term, including David E. Swenson, Affinity Static Control Consulting, president; Donn Bellmore, Universal Instruments, senior vice president; and Leo G. Henry, ESD-TLP Consulting, vice president.
The ESDA is an organization dedicated to furthering the technology and understanding of electrostatic discharge.
The new board will serve for a three-year term beginning Jan. 1.
The board also elected its officers for a one-year term, including David E. Swenson, Affinity Static Control Consulting, president; Donn Bellmore, Universal Instruments, senior vice president; and Leo G. Henry, ESD-TLP Consulting, vice president.
The ESDA is an organization dedicated to furthering the technology and understanding of electrostatic discharge.
LAKE TAHOE, CA – The ESD Association requests abstracts for the 3d annual International Electrostatic Discharge Workshop.
The workshop will be held May 18 - 21 at the Stanford Sierra Conference Center in Lake Tahoe, CA.
The event invites focus on the increasing importance of system level ESD design and test, as well as the relationship between system and component level ESD. Presentations should address at least one of the following: novel design concepts, special custom design approaches, technology integration issues, failure analysis, test structures, simulation tools, component-level ESD testing, characterization, system-level issues, and unresolved ESD issues.
Abstracts should be two pages and emailed in PDF format to iew@esda.org no later than Nov. 14.
The technical program committee will announce the selections on or before Dec. 5.
The call for presentations may be downloaded from www.esda.org.
The workshop will be held May 18 - 21 at the Stanford Sierra Conference Center in Lake Tahoe, CA.
The event invites focus on the increasing importance of system level ESD design and test, as well as the relationship between system and component level ESD. Presentations should address at least one of the following: novel design concepts, special custom design approaches, technology integration issues, failure analysis, test structures, simulation tools, component-level ESD testing, characterization, system-level issues, and unresolved ESD issues.
Abstracts should be two pages and emailed in PDF format to iew@esda.org no later than Nov. 14.
The technical program committee will announce the selections on or before Dec. 5.
The call for presentations may be downloaded from www.esda.org.
Press Releases
- NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Nordson Test & Inspection Expands Partnership with Distributor smartTec Nordic A/S