News
SMYRNA, GA – UP Media Group, parent company of Circuits Assembly and Printed Circuit Design & Fab, will broadcast "Optimize System Performance with FPGA/PCB Co-Design," a 45-minute free Webinar, on June 3, at 2 PM EDT.
Bob Potock, director of FPGA marketing for Mentor Graphics, Systems Design Division, will discuss how new FPGA/PCB concurrent design processes and tools can significantly improve system performance and product costs, as well as designer productivity. Attendees will learn the elements of an effective FPGA on-board strategy, how to boost productivity and PCB quality, and be introduced to specific implementation options.
This event is the third in a series of Webinars addressing how to efficiently design today’s increasingly complex PCBs in the competitive electronics industry.
HAUPPAUGE, NY –API Nanotronics Corp. has named Steve Pudles chief executive officer. He succeeds Phillip DeZwirek, who remains chairman.
Pudles is the former CEO and president of Nu Visions Manufacturing, where he led the company from $10 million in revenue to more than $100 million in a six-year period. He has 25 years’ electronics industry experience.
API supplies electronic components and conducts nanotechnology R&D for the defense and communications sectors.
Pudles has worked for a number of EMS firms and was recently elected secretary and treasurer of the IPC board.
Pudles is the former CEO and president of Nu Visions Manufacturing, where he led the company from $10 million in revenue to more than $100 million in a six-year period. He has 25 years’ electronics industry experience.
API supplies electronic components and conducts nanotechnology R&D for the defense and communications sectors.
Pudles has worked for a number of EMS firms and was recently elected secretary and treasurer of the IPC board.
ENDICOTT, NY – The U.S. Department of Defense has awarded Endicott Interconnect Technologies a $148.6 million contract modification to its current program to supply finished assemblies for a high-reliability, high-performance computing application.
Under the deal, EI produces card frame assemblies, including HyperBGA organic semiconductor packaging, multichip module assemblies, PCBs, functionally tested assemblies, and supplies engineering services.
Under the deal, EI produces card frame assemblies, including HyperBGA organic semiconductor packaging, multichip module assemblies, PCBs, functionally tested assemblies, and supplies engineering services.
The contract modification period is from May to December this year.
