SHANGHAI -- As first reported by Circuits Assembly, IPC and Messe Munchen International have inked a deal under which the two groups will cooperate on an assembly trade show China. No financial terms were disclosed. The announcement was made yesterday by MMI managing director Klaus Dittrich.
The show, Electronica and Productronica China 2009, will be co-located next year with the CPCA Show and
Semicon China at the Shanghai International Exhibition Center in
Pudong.
The four shows expect to attract 3,000 exhibitors across 130,000 sq. ft. of display space and draw 100,000 attendees.
SAN JOSE — The
U.S. Display Consortium today
announced a one-year development contract with Optomec to further develop its
M3D Aerosol Jet System for printed electronics. The $750,000
cost-shared award will provide Optomec the opportunity to extend its proprietary
additive manufacturing technology to a level that has not been possible before
through more traditional printing techniques.
The USDC is a public/private partnership chartered with
developing the flexible electronics and displays industry supply chain.
Under the agreement, Optomec will focus on
developing a printing platform for next-generation devices, such as high-density
circuitry for printable electronics, displays and photovoltaic cells. The new
printing system will use a multi-nozzle aerosol jet deposition that eliminates
the need for screens or stencils required by traditional contact deposition
processes, while enabling much finer resolution (4 µm widths). The
additive process is said to reduce environmental impact by minimizing
waste and chemicals that are part of traditional manufacturing
processes.
“The USDC project will build on Optomec's existing printed
electronics solution, which is already gaining traction in the production of
more efficient solar cells, embedded sensors and life science devices,” said Optomec president David Ramahi.