News
SHENZHEN – Endicott Interconnect Technologies has signed a lease to supply fully assembled boards via a 40,000 sq. ft. facility in Shenzhen. The lease currently covers space for one line, company sources say.
“Once volume production ramps for many boards, it can occur at EI Shenzhen, which offers both a volume production site and lower cost manufacturing,” said Stephen Howland, product manager of EI complex assembly operations.
EI Shenzhen can provide high-density hybrid PCB assemblies – double-sided complex boards with mixed technologies and an average component count of > 1500 – in sizes as large as 8" x 24" for SMT or non-SMT backplanes, the company reports.
Assembly technologies include SMT, press fit, wave solder, selective PTH solder, and hand assembly and solder. Components that can be placed on-board include high I/O area array modules (BGA/CGA down to 0.03" pitch, and PBGA), fine pitch leaded parts, and SMT discretes and chips down to 0402 size, as well as high-density, high-I/O connectors. Complete mechanicals – cage, chassis and system assemblies – can be provided, EI says.
Products for which the Shenzhen facility can provide production include motherboards for servers and communication applications, as well as controller boards for various medical and IT applications.
“Once volume production ramps for many boards, it can occur at EI Shenzhen, which offers both a volume production site and lower cost manufacturing,” said Stephen Howland, product manager of EI complex assembly operations.
EI Shenzhen can provide high-density hybrid PCB assemblies – double-sided complex boards with mixed technologies and an average component count of > 1500 – in sizes as large as 8" x 24" for SMT or non-SMT backplanes, the company reports.
Assembly technologies include SMT, press fit, wave solder, selective PTH solder, and hand assembly and solder. Components that can be placed on-board include high I/O area array modules (BGA/CGA down to 0.03" pitch, and PBGA), fine pitch leaded parts, and SMT discretes and chips down to 0402 size, as well as high-density, high-I/O connectors. Complete mechanicals – cage, chassis and system assemblies – can be provided, EI says.
Products for which the Shenzhen facility can provide production include motherboards for servers and communication applications, as well as controller boards for various medical and IT applications.
WILSONVILLE, OR – Mentor Graphics Corp. chairman and CEO Dr. Wally Rhines will keynote the International System-on-Chip Design Conference in Seoul later this month.
Dr. Rhines’s talk will focus on changing the design rules, the company announced.
The conference runs Oct. 15-16.
For more information, visit http://www.isocc.org/.
Dr. Rhines’s talk will focus on changing the design rules, the company announced.
The conference runs Oct. 15-16.
For more information, visit http://www.isocc.org/.
ELK GROVE VILLAGE, IL – The electronics industry lost one of its more charming personalities last week as Stuart Blankstein, president of ACL Staticide, died following a bacterial infection.
He leaves a wife, Karen, and three children.
Funeral services were held in Skokie, IL.
In lieu of flowers, donations may be made to your charity of choice.
To sign his memorial book, click here:
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