News
SAN JOSE – The MicroElectronics
Packaging and Test Engineering Council announced its technical symposium
Substrates: The Foundation of Semiconductor Packaging, to be held in San Jose
Nov. 8.
The objective of this symposium is to identify technology requirements for the next generation of substrate technology, highlighting required innovations that will further enable IC component integration, and electronic system functionality.
The program is segmented into the following areas: Substrate Manufacturing and 1st Level Interconnect Technology; Design and Simulation: Silicon, Substrate, System; 2nd Level Interconnect and Reliability, and Emerging Substrate Technologies.
For more information, visit www.meptec.org.
The objective of this symposium is to identify technology requirements for the next generation of substrate technology, highlighting required innovations that will further enable IC component integration, and electronic system functionality.
The program is segmented into the following areas: Substrate Manufacturing and 1st Level Interconnect Technology; Design and Simulation: Silicon, Substrate, System; 2nd Level Interconnect and Reliability, and Emerging Substrate Technologies.
For more information, visit www.meptec.org.
SHENZHEN – Kasion Automation
Ltd. on Sept. 28 celebrated its 15th year in China.
More than 150 people were present, including all employees of Kasion from offices in Beijing, Tianjin, Shanghai, Nanjing, Shenzhen and the company’s Hong Kong headquarters; its subsidiary colleagues; customers Artesyn (Emerson), Celestica, Chung Nam, Computime, Elcoteq, Flextronics, Hasee, Hip Fung, Honeywell, Huawei, Konka, Refined Industry, Sangfei, Vtech, Zastron, and manufacturing suppliers, including Assembleon, BTU, BPM, CASIO, PVA and VJ Electronix.
Abby Tsoi, director of Kasion, kicked off the celebration with a welcome speech and presentation of the Long Service Awards, Excellent Performance Awards and Outstanding Performance Awards for employees.
Stephen Wu, area manager of North China, received awards for 15 years of service and sales performance. Kelvin Sze earned award for sales, and Rebecca Tse received a performance award, in addition to their service gold medals.
More than 20 employees were presented with service and performance awards, while Kasion’s customers and principal manufacturing suppliers received the Excellent Partnership Awards, presented by GM SK Chiu.
More than 150 people were present, including all employees of Kasion from offices in Beijing, Tianjin, Shanghai, Nanjing, Shenzhen and the company’s Hong Kong headquarters; its subsidiary colleagues; customers Artesyn (Emerson), Celestica, Chung Nam, Computime, Elcoteq, Flextronics, Hasee, Hip Fung, Honeywell, Huawei, Konka, Refined Industry, Sangfei, Vtech, Zastron, and manufacturing suppliers, including Assembleon, BTU, BPM, CASIO, PVA and VJ Electronix.
Abby Tsoi, director of Kasion, kicked off the celebration with a welcome speech and presentation of the Long Service Awards, Excellent Performance Awards and Outstanding Performance Awards for employees.
Stephen Wu, area manager of North China, received awards for 15 years of service and sales performance. Kelvin Sze earned award for sales, and Rebecca Tse received a performance award, in addition to their service gold medals.
More than 20 employees were presented with service and performance awards, while Kasion’s customers and principal manufacturing suppliers received the Excellent Partnership Awards, presented by GM SK Chiu.
Kasion has grown more than 10 times since it was established.
SANTA CLARA, CA – The Electronics Supply Chain Association announced Jim Miller of Cisco Systems has been added as a keynote presenter for the 11th Annual Electronics Supply Chain Association Conference, Oct. 29-31, in Santa Clara.
Miller, vice president, product operations, will present Value Creation throughout the Product Lifecycle.
In addition, Paul R. Brody, partner, IBM Global Business Services and Global Lead, Electronics Industry Strategy Practice, will present the opening keynote on Optimization through Collaboration: Going it Alone is No Longer an Option, and Beth McKone, vice president of worldwide program management and supply chain solutions for Solectron Corporation, will present Supply Chain Orchestration – Changing the Game by Changing the Rules.
For more information, visit www.electronicssupplychain.org.
Miller, vice president, product operations, will present Value Creation throughout the Product Lifecycle.
In addition, Paul R. Brody, partner, IBM Global Business Services and Global Lead, Electronics Industry Strategy Practice, will present the opening keynote on Optimization through Collaboration: Going it Alone is No Longer an Option, and Beth McKone, vice president of worldwide program management and supply chain solutions for Solectron Corporation, will present Supply Chain Orchestration – Changing the Game by Changing the Rules.
For more information, visit www.electronicssupplychain.org.
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