News
HUNTSVILLE – The Conformal Coating & Fluid Dispensing Technology Seminar will take place Sept. 13 at the Huntsville Marriott in Huntsville, AL.
The free seminar will focus on the latest developments in coating, assembly materials and jet dispensing technology; military applications; tin whiskers and how to avoid them.
Participants will learn about different coating materials and the best ways to select, cure and apply them, including aqueous, acrylic, silicone, and heat-humidity cure materials; tin whiskers and how to avoid them; fluid jetting processes and material applications; the advantages of non-contact jetting underfill and other fluid materials for electronics assembly.
Speakers at this event include Asymtek, Nordson, Dow Corning, Dymax, Henkel Technologies and Humiseal.
To register, visit: http://www.asymtek.com/news/seminars/huntsville2007/register.htm.
LAKE BUENA VISTA, FL – ECTC requests 750-word abstracts on papers representing developments and knowledge in the following areas: advanced packaging; materials and processing; electronics components and RF; modeling and simulation; emerging technologies; optoelectronics; interconnections; posters; manufacturing technology, and quality and reliability.
Proposals are also solicited for educational short courses (4 hours) on topics described in the call for papers. Proposals including course descriptions must be submitted at www.ectc.net.
The deadline for abstracts is Oct. 15.
Authors will be notified of acceptance with instructions for publication by Dec. 15.
The first 100 abstracts will be entered into a drawing for a chance to win a free registration.
Manuscripts are due in final form for publication by Feb. 25.
Proposals are also solicited for educational short courses (4 hours) on topics described in the call for papers. Proposals including course descriptions must be submitted at www.ectc.net.
The deadline for abstracts is Oct. 15.
Authors will be notified of acceptance with instructions for publication by Dec. 15.
The first 100 abstracts will be entered into a drawing for a chance to win a free registration.
Manuscripts are due in final form for publication by Feb. 25.
For more information, visit http://www.ectc.net/ABSTRACT2008/input.cfm.
FRANKLIN, MA – On Oct. 18, Speedline will present a free Webcast on upstream solder joint defect inspection and the transition from “quality through inspection” to “quality through design,” with a concentration on the printing process.
The one-hour presentation will begin at 11 a.m. EST.
Specific areas of discussion will include an overview of the printing process; different inspection techniques; the effects of components and paste types on defects, and a review of experimental research currently underway. The ultimate goal is to predict the likelihood of solder joint defects before they occur, and to adjust design and processes to limit their occurrence.
To register, visit www.speedlinetech.com/seminars.
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