News
KALMAR, SWEDEN -- Hoping to expand its business in Europe, Ethertronics has acquired Flextronics' design center here for an undisclosed sum.
BANNOCKBURN, IL – A new report on silicon-on-chip and system-in-package integration identifies embedded components as a key emerging technology in component and product miniaturization.
The research, by Prismark Partners, looks at the impact of miniaturization on the supply chain and how it drives certain technology and business shifts.
TOYKO – Expanded significantly from last year’s edition,
Nepcon World Tokyo used both the massive East and West Halls at the Tokyo Big
Sight convention center, in part to accommodate the arrival of a major fiber
optics wing. Even better: The halls were packed with visitors all three days.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing