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SHANGHAIBusiness Media China has issued a call for papers for the China SMT Forum scheduled for Nov. 4-6 at the Shanghai International Exhibition Center.
 
Abstracts are requested for sessions on lead-free soldering and RoHS-conform technologies, semiconductor packaging and power electronics, PCB technologies, surface finishes and quality control, reliability and testing, assembling and soldering technologies, and electronic markets and future trends.
 
The deadline for abstracts is April 15.
 
For more information, visit www.chinasmtforum.com
HERNDON, VAiNEMI is gearing up for development of its 2009 Roadmap and is looking for industry experts to contribute.
 
The North American kick-off meeting is Feb. 20-21 at H-P in Cupertino, CA and is open to anyone who wants to participate.
  Read more ...
SAN JOSESanmina-SCI today said its first-quarter fiscal 2008 revenue would be $2.53 billion, in line with previous guidance of $2.5 billion to $2.65 billion. Read more ...

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