News
MINNEAPOLIS, MN – The opening session and annual meeting/keynote address during SMTA International will be held Oct. 9 and 10, respectively, in Orlando.
The free opening session will focus on SMTA’s End Game: Lead-Out, Labels-On, Reliability-In. Marking, Symbols, and Labels for Pb-Free Identification will be led by Steve Greathouse of Greathouse Solutions, and Pb-Free Printed Circuit Board Reliability will be led by Werner Engelmaier of Engelmaier Associates.
The SMTA annual meeting will feature Andrew Alduino, Senior Optical Researcher in the Photonics Technology Lab of Intel Corp. Implementation Challenges of Future Optical Interconnects will address the challenges facing integration to photonics technology, including thermal management, multi-chip package concerns, alignment of components, and more.
The 2006 conference award winners will be recognized, including Best of Conference Presentation, Dave Hillman, Rockwell Collins; Best Proceedings Paper, Robert Darveaux, Ph.D., Amkor Technology; and Best International Paper, Heather McCormick, Celestica, Inc.
At the meeting, the SMTA will present its Association Awards and the Charles Hutchins Educational Grant for $5,000, an award that is given annually to a graduate-level student pursuing a degree and working on thesis research in electronics packaging or related field. (Circuits Assembly funds the grant using proceeds of its Service Excellence Awards.)
The cost for the SMTA annual meeting is $40 for members and $50 for nonmembers.
The free opening session will focus on SMTA’s End Game: Lead-Out, Labels-On, Reliability-In. Marking, Symbols, and Labels for Pb-Free Identification will be led by Steve Greathouse of Greathouse Solutions, and Pb-Free Printed Circuit Board Reliability will be led by Werner Engelmaier of Engelmaier Associates.
The SMTA annual meeting will feature Andrew Alduino, Senior Optical Researcher in the Photonics Technology Lab of Intel Corp. Implementation Challenges of Future Optical Interconnects will address the challenges facing integration to photonics technology, including thermal management, multi-chip package concerns, alignment of components, and more.
The 2006 conference award winners will be recognized, including Best of Conference Presentation, Dave Hillman, Rockwell Collins; Best Proceedings Paper, Robert Darveaux, Ph.D., Amkor Technology; and Best International Paper, Heather McCormick, Celestica, Inc.
At the meeting, the SMTA will present its Association Awards and the Charles Hutchins Educational Grant for $5,000, an award that is given annually to a graduate-level student pursuing a degree and working on thesis research in electronics packaging or related field. (Circuits Assembly funds the grant using proceeds of its Service Excellence Awards.)
The cost for the SMTA annual meeting is $40 for members and $50 for nonmembers.
SHENZHEN — Nepcon EMT South China will take place Aug. 28-31 at the Shenzhen Convention and Exhibition Center.
This year's show will be held in conjunction with Automotive Electronics China and Assembly Expo China, bringing together 450 exhibitors from 22 countries, according to the show organizers.
This year's show will be held in conjunction with Automotive Electronics China and Assembly Expo China, bringing together 450 exhibitors from 22 countries, according to the show organizers.
The Nepcon event is expected to draw up to 18,000 attendees, says Reed Exhibitions. The show includes a concurrent technical conference.
Also running that week: the SMTA China South Conference.
SAN JOSE, CA – The global semiconductor materials market is expected to grow more than 10% in 2007, and is forecasted to grow another 10% next year, SEMI reports.
Growth is being driven by record numbers of semiconductor devices being manufactured and materials consumed in fabricating and packaging those devices, says the association.
Growth is expected both in wafer fab materials and packaging. Current estimates predict that fab materials will grow about 9% to $24 billion, and packaging materials will rise more than 13% to $16.6 billion this year, according to SEMI.
On a regional basis, both Japan and Taiwan are anticipated to remain the two largest material-consuming regions, followed by the South Korean and Southeast Asian regions.
The materials market in China grew 36% last year as the result of capacity coming online from renewed fab and assembly facility investments; it is expected that wafer fab materials will represent a larger portion of materials consumed in this region in the near future, says the association.
Growth is being driven by record numbers of semiconductor devices being manufactured and materials consumed in fabricating and packaging those devices, says the association.
Growth is expected both in wafer fab materials and packaging. Current estimates predict that fab materials will grow about 9% to $24 billion, and packaging materials will rise more than 13% to $16.6 billion this year, according to SEMI.
On a regional basis, both Japan and Taiwan are anticipated to remain the two largest material-consuming regions, followed by the South Korean and Southeast Asian regions.
The materials market in China grew 36% last year as the result of capacity coming online from renewed fab and assembly facility investments; it is expected that wafer fab materials will represent a larger portion of materials consumed in this region in the near future, says the association.
“Semiconductor unit growth, the 300 mm ramp, and the transition to flip chip packages are driving the revenue growth in the semiconductor materials market,” said Dan Tracy, senior director of Industry Research and Statistics of SEMI. "However, higher raw material costs represent a major challenge for both material suppliers and their customers.”
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