Circuits Assembly Online Magazine - Current Issue

News

DURHAM, NC – The SMTA’s 3D/SiP/Advanced Packaging Symposium will be held Apr. 29-30 at the Washington Duke Inn & Golf Club, Durham, NC.

The symposium will provide research in the field of advanced packaging with particular attention to materials, manufacturing, assembly and Package/PWB reliability in a Pb-free environment.

Two-hundred to 300-words abstracts are being requested in the following areas: system in package; multi-chip packaging; materials/finishes/solder alloys; reliability; package on package; enabling technologies; die stacking/3D assembly; wafer-level packaging; bumping/flip chip on board; handheld electronics/miniaturization; 3D wafer level integration; 3D wafer level packaging; die/package/system co-design; modeling and simulation; drop/shock/bend performance, and infrastructure.

Send abstracts in Word to Melissa Serres, Melissa@smta.org.

Please include name, company, mailing address, telephone number, fax, e-mail, and presentation title.

The deadline for abstracts is Nov. 30.

Speakers will be required to submit presentation slides if selected.

SAN JOSE, CA – At the First Occam Process Developers Meeting on Oct. 17, the first three agreements for the development of the Occam process were established.

Companies committing to develop processes and work with interested OEMs to produce Occam products include microelectronics assembly company Promex Industries, PCB fabricator Micropress, and Hunter Technology Group.

Dick Otte, president of Promex stated, “We are just completing our first set of Occam process manufacturing runs … we’re excited about joining our Occam Process partners … and utilizing Occam to broaden our microelectronic assembly services.”

“We want to be the Occam Process leader in South America,” said, Gilmar Aparecido de Souza, president of Micropress, located in Sao Paulo, Brazil. “With over 2,000 customers in Brazil and throughout South America, we want to drive the Occam Process into our market … we will have our first Occam Process ‘fabsemblies’ completed within a few months.”

WELLESLY, MA – The global market for biometrics was worth nearly $2 billion in 2006 and is expected to increase to $2.7 billion in 2007 and $7.1 billion by 2012, a CAGR of 21.3% over the next five years, according to a report from BCC Research.

Fingerprint biometrics will continue to be the main revenue contributor, worth $1.3 billion in 2007. This market is forecast to grow to $2.7 billion by 2012, a CAGR of 16.3% during the period.

The main reason for this growth is the decrease in price of fingerprint sensors, and government initiatives that rely heavily on fingerprint biometrics, BCC said.

The second largest segment is face recognition. This market will grow to $1.3 billion by 2012, from $459 million in 2007, a CAGR of 23.8%. Hand biometry will be the next largest segment in 2007 with market revenue of $243 million. By 2012, the market value for this segment will be $752.6 million, the firm reported.

The remaining biometric segments of iris scan, middleware, multimodality, voice recognition, signature verification and other emerging segments constituted $729 million in 2007. These segments are estimated to grow at a CAGR of 26% to $2.3 billion by 2012.

In terms of region, Europe currently leads the biometrics market because of higher user acceptance and the introduction of biometric passports in the majority of European countries. However, the highest potential lies in the Asian region where technologically developed countries such as South Korea and Japan, and growing countries such as China and India, will drive growth, BCC concludes.