News
SAN JOSE, CA – With 137 billion ICs produced, the value of the worldwide IC packaging market was $27.3 billion in 2006, reports Electronic Trend Publications in its Worldwide IC Packaging Market, 2007 Edition. Growth will reportedly continue to occur through 2008, with a probable slowdown in 2009, says the researcher.
HERNDON, VA – Industry-led consortium iNEMI today announced a majority of its OEM and EMS members strongly support unique part numbers for BGA components to differentiate any Pb-free ball metallurgies other than SAC 305 or SAC 405.
Concerned about changes in metallurgies, iNEMI informs that variations can impact the manufacturing process, including form, fit and function of a device. According to members, they should be documented by the issuance of a part change notice and should be associated with a change in manufacturing part number. In this way, the manufacturing assembly process can be properly controlled prior to actual assembly to ensure reliable attachment of the BGA to the next higher assembly and to help minimize ship holds as a result of unknown parts, iNEMI says.
iNEMI members in support of this proposal include Agilent, Celestica, HP, Intel, Jabil Circuit, Microsoft, Plexus, Sanmina-SCI, Solectron and Tyco Electronics, among others.
In 2004, iNEMI called for the use of unique part numbers for RoHS-compliant components, as defined by JEDEC/IPC standards. The consortium is also calling for continued availability of SnPb BGAs for use in high-reliability products, which are currently exempt from the EU RoHS Directive. Manufacturers of these high-reliability products will continue to use SnPb processes until long-life reliability concerns regarding Pb-free are resolved, and Pb-free BGAs are not compatible with these processes, says the consortium.
ARMONK, NY – IBM this week claimed to be first to apply a self-assembling nanotechnology to conventional chip manufacturing. The company expects to have the technology ready for wide-scale use by 2009.
The natural pattern-creating process that forms seashells, snowflakes and enamel on teeth reportedly has been harnessed to form trillions of holes to create insulating vacuums around the miles of nano-scale wires packed next to each other inside each computer chip.
The new technique to make airgaps by self-assembly skips the masking and light-etching process. Instead, IBM scientists discovered a mix of compounds they pour onto a silicon wafer with wired chip patterns before baking it.
Compounds assemble in a directed manner, creating trillions of uniform, nano-scale holes across an entire 300 mm wafer. These holes are just 20 nm in diameter, up to five times smaller than those using today’s lithography technique.
Researchers have proven electrical signals on the chips can flow 35% faster, or the chips can consume 15% less energy compared to advanced chips using conventional techniques.
The self-assembly process has been integrated with IBM's manufacturing line in East Fishkill, NY, and is expected to be fully incorporated in IBM’s manufacturing lines and used in chips in 2009. The chips will be used in IBM's server product lines and thereafter for chips IBM builds for other companies.
The natural pattern-creating process that forms seashells, snowflakes and enamel on teeth reportedly has been harnessed to form trillions of holes to create insulating vacuums around the miles of nano-scale wires packed next to each other inside each computer chip.
The new technique to make airgaps by self-assembly skips the masking and light-etching process. Instead, IBM scientists discovered a mix of compounds they pour onto a silicon wafer with wired chip patterns before baking it.
Compounds assemble in a directed manner, creating trillions of uniform, nano-scale holes across an entire 300 mm wafer. These holes are just 20 nm in diameter, up to five times smaller than those using today’s lithography technique.
Researchers have proven electrical signals on the chips can flow 35% faster, or the chips can consume 15% less energy compared to advanced chips using conventional techniques.
The self-assembly process has been integrated with IBM's manufacturing line in East Fishkill, NY, and is expected to be fully incorporated in IBM’s manufacturing lines and used in chips in 2009. The chips will be used in IBM's server product lines and thereafter for chips IBM builds for other companies.
Press Releases
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Chihuahua Expo & Tech Forum
- PDR Appoints Bob Pearson of PAC-Global Texas to Central Texas Region
- Avalon Technologies Expands PCB Assembly And Design Services To Meet Growing Demand In The Electronics Industry
- KYZEN to Promote Pair of Stencil Cleaning Chemistries at SMTA Chihuahua Expo & Tech Forum