Circuits Assembly Online Magazine - Current Issue

News

SANTA CLARA, CA – RadiSys Corp. will purchase certain assets of Intel Corp.’s modular communications platforms business for $25 million plus $6.75 million of inventory and other considerations.

TOKYO — Sony executive Hideki Komiyama was named president of Sony Ericsson, replacing president Miles Flint, who will pursue new business and personal opportunities.

Komiyama was chairman of Sony's U.S. operations and executive vice president of electronics marketing and sales.

Flint, who was president the past four years, spurred the company's success by co-branding the Walkman name on phones, kicking off the so-called "lead experience" trend now copied by other OEMs.

Sony Ericsson is fourth among cellphone vendors, ahead of LG, and could yet overtake Motorola for third, some analysts believe.

Komiyama is expected to maintain the course charted under Flint. The company is expected to expand in the U.S. and extend its high-end lines, analysts say.

HUNTSVILLE – The Conformal Coating & Fluid Dispensing Technology Seminar will take place Sept. 13 at the Huntsville Marriott in Huntsville, AL.

The free seminar will focus on the latest developments in coating, assembly materials and jet dispensing technology; military applications; tin whiskers and how to avoid them.

Participants will learn about different coating materials and the best ways to select, cure and apply them, including aqueous, acrylic, silicone, and heat-humidity cure materials; tin whiskers and how to avoid them; fluid jetting processes and material applications; the advantages of non-contact jetting underfill and other fluid materials for electronics assembly.

Speakers at this event include Asymtek, Nordson, Dow Corning, Dymax, Henkel Technologies and Humiseal.

To register, visit: http://www.asymtek.com/news/seminars/huntsville2007/register.htm.