News
PLEASANT PRAIRIE, WI – Promation has been selected to design and build a custom conveyor solution that will permit the manufacture of large platform elevator control cabinets in a progressive assembly line.
The company’s power-driven roller conveyor solutions coupled with air bladder lifts, product rotating stations with overhead lighting, and tool trolleys and power crossover stations have been integrated to create a safe assembly line to manufacture the customer’s 650 lb. control cabinets.
The company’s power-driven roller conveyor solutions coupled with air bladder lifts, product rotating stations with overhead lighting, and tool trolleys and power crossover stations have been integrated to create a safe assembly line to manufacture the customer’s 650 lb. control cabinets.
TEDDINGTON, UK – The upcoming Soldering Science & Technology Club meeting will take place May 24 at the National Physical Laboratory in Teddington, UK. Presentations will include Improving the Prediction of Reliability Performance of Lead-Free Assemblies; Reliability in High Frequency Vibration of Lead-Free Solder Joints; A New Technique for Reliability Assessment based on Power Cycling; Corrosion Properties of Lead-Free Alloys; Measuring the Tin-pest Transformation; Thermal Management Technology Developments in the US; Reliability of Substrates after Processing at Lead-Free Soldering Temperatures, and Will Tin Finished Components Whisker? NPL also will launch an Industry Defect Database and there will be a tabletop exhibition. This event is suited for technologists, engineers and designers, and others wishing to gain a general background in field failures. For information, contact Dr. Chris Hunt at chrishunt@npl.co.uk.
DEARBORN, MI – The Society of Manufacturing Engineers and its Electronics Manufacturing Tech Group named Professor R. Wayne Johnson winner of its 2007 Total Excellence in Electronics Manufacturing Award. The annual award recognizes extraordinary dedication and innovation in setting new or higher levels of achievement in electronics manufacturing. Johnson is a professor of electrical engineering at Auburn University and director of the Laboratory for Electronics Assembly and Packaging (LEAP). At Auburn, he has established teaching and research laboratories for advanced packaging and electronics manufacturing. His research efforts are focused on the materials, processing, and reliability aspects of electronics manufacturing. Current projects include lead-free electronics assembly, mixed lead-free and Sn/Pb electronics assembly, wafer-level packaging, flip-chip assembly, assembly of ultra thin Si die, and electronics packaging for extreme environments. He has published 52 journal papers, 135 conference papers, six book chapters and co-edited one book on electronics packaging and electronics manufacturing. Johnson holds one U.S. patent.
Press Releases
- Avalon Technologies Expands PCB Assembly And Design Services To Meet Growing Demand In The Electronics Industry
- KYZEN to Promote Pair of Stencil Cleaning Chemistries at SMTA Chihuahua Expo & Tech Forum
- Nordson Electronics Solutions Completes its Europe Location Move to a New, State-of-the-Art Facility
- Ascentron Upgrades Entire Hand Soldering Line to Ersa i-CON 1 MK2