News
BANNOCKBURN, IL – North American PCB shipments fell 2.6% in January and bookings dropped 18.7% year-over-year, the IPC said. The book-to-bill ratio remained under parity at 0.91.
Rigid shipments were down 3.5%, and bookings were down 19.2% year-over-year. Flexible circuit shipments were up 14.3%, while bookings were down 10.6%.
The rigid book-to-bill ratio was 0.91; the flex circuit book-to-bill ratio edged up to 0.93.
Rigid PCBs make up an estimated 85% of PCB sales in North America.
The results include 11% of foreign-produced boards.
Rigid shipments were down 3.5%, and bookings were down 19.2% year-over-year. Flexible circuit shipments were up 14.3%, while bookings were down 10.6%.
The rigid book-to-bill ratio was 0.91; the flex circuit book-to-bill ratio edged up to 0.93.
Rigid PCBs make up an estimated 85% of PCB sales in North America.
The results include 11% of foreign-produced boards.
SAN JOSE – A call for papers has been issued for the International Wafer-Level Packaging Conference scheduled for Sept. 17-19, in San Jose. The conference program will include workshops, and business and technical sessions on wafer-level packaging, 3D/stacked packaging and test. The organizers seek 200-word abstracts with proposed topics. Abstracts should be submitted before Apr. 10 to Melissa Serres at melissa@smta.org. Full details may be found at http://www.smta.org/iwlpc.
MINNEAPOLIS – The 2007 Medical Electronics Symposium will be held May 2-3 in Bloomington, MN. A tabletop exhibition will take place on May 2, and a half-day workshop symposium on May 1 will cover issues of reliability in medical electronics and medical device applications. Other topics of the symposium include RoHS/WEEE impact on design; wireless telemetry; process development case studies; substrate materials for medical electronics; design challenges; environmental constraints; emerging technologies; advanced cleanliness requirements; advanced packaging for medical electronics; reliability assessments; software security; safety & risk management; warranty analytics; risk communication and software regulation. The keynote, Neuromodulation – Approaching the Tipping Point, will be presented May 2 at 11:30 am by Christopher Chavez of Advanced Neuromodulation Systems. For more information, please visit http://www.smta.org/education/symposia/symposia.cfm#medical.
Press Releases
- Avalon Technologies Expands PCB Assembly And Design Services To Meet Growing Demand In The Electronics Industry
- KYZEN to Promote Pair of Stencil Cleaning Chemistries at SMTA Chihuahua Expo & Tech Forum
- Nordson Electronics Solutions Completes its Europe Location Move to a New, State-of-the-Art Facility
- Ascentron Upgrades Entire Hand Soldering Line to Ersa i-CON 1 MK2