News
TAIPEI – Hon Hai, Taiwan's top electronic parts maker, is likely to buy part of the stake Philips wants to sell in South Korea's LG.Philips LCD, local newspapers reported.
Economic Daily News said the move could help Innolux Display, a screen maker that assembles LCD monitors under the Hon Hai group, secure more panels.
Hon Hai officials were not available for comment.
Dutch company Philips Electronics owns about a one-third stake in LG.Philips LCD, the world's No.2 LCD maker, worth about $5.4 billion at current market prices, according to Reuters data.
Philips has said it plans to sell at least part of its stake in LG.Philips once its ownership lockup expires this month.
Japan's Matsushita and Toshiba have also been mentioned as possible candidates to buy Philips' shares.
Earlier this week, the head of LG.Philips LCD said Philips is unlikely to sell its stake in the market, although such a transaction could not be ruled out.
SEOUL – Samsung Electronics’ second-quarter net profit fell 5% year-over-year, says its quarterly report. And profits were down 11% from the first quarter, driven in part by DRAM price decline.
FRANKLIN, MA – Speedline Technologies will present a Webcast on reduction/elimination of two common SMT defects: tombstoning and mid-chip solder balls. The one-hour presentation takes place Aug. 16 at 11 a.m. EDT.
The Webinar will review some of the studies and experiments conducted to determine and eliminate the causes of tombstoning. Specific areas of analysis will include solderability, paste volume, placement issues, and pad surface area/design criteria.
Topics to be reviewed in discussing mid-chip solder ball elimination will include stencil design, board design, reflow profile development, component placement accuracy, and solder paste printing.
To register, visit www.speedlinetech.com/seminars.
The Webinar will review some of the studies and experiments conducted to determine and eliminate the causes of tombstoning. Specific areas of analysis will include solderability, paste volume, placement issues, and pad surface area/design criteria.
Topics to be reviewed in discussing mid-chip solder ball elimination will include stencil design, board design, reflow profile development, component placement accuracy, and solder paste printing.
To register, visit www.speedlinetech.com/seminars.
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