News
YAVNE, ISRAEL – Orbotech Ltd. today updated its 2007 revenue forecast for flat panel display inspection equipment to about $50 million, approximately $35 million less than previously anticipated.
About $20 million worth of sales will come in the second half, the company said in a statement today.
After the first quarter, the company indicated it expected a downturn due to lower spending by FPD manufacturers. This downturn is now estimated to be deeper than previously anticipated, as LCD manufacturers delay scheduled “move in” dates for new fabrication facilities to mid-2008, Orbotech said.
About $20 million worth of sales will come in the second half, the company said in a statement today.
After the first quarter, the company indicated it expected a downturn due to lower spending by FPD manufacturers. This downturn is now estimated to be deeper than previously anticipated, as LCD manufacturers delay scheduled “move in” dates for new fabrication facilities to mid-2008, Orbotech said.
The company expects strong rebound in FPD revenues in 2008, based on forecasts for strong second-half bookings and “significant indications” of a substantial upturn next year.
WILLOW GROVE, PA – Manncorp is offering qualified visitors to www.smtsolderpaste.com a free 250g jar of solder paste.
Four choices are offered: no-clean Pb-free, Pb-free water soluble, and Pb no-clean and water soluble. The free sample is available to any legitimate user of solder paste. Limit one per company.
CEO Henry Mann anticipates major market penetration of its solder pastes. Manncorp distributes Shenmao solders throughout North America.
Four choices are offered: no-clean Pb-free, Pb-free water soluble, and Pb no-clean and water soluble. The free sample is available to any legitimate user of solder paste. Limit one per company.
CEO Henry Mann anticipates major market penetration of its solder pastes. Manncorp distributes Shenmao solders throughout North America.
BINGHAMTON, NY – The Unovis Solutions Area Array Consortium gathered in June for a detailed review of this year’s research tracks.
Progress reports were presented on efforts to understand the complex microstructures of Pb-free solder joints and their impact on reliability. Issues pertaining to the reliability of printed circuit materials and designs, as well as QFN and FCBGA assembly and underfilling, were also discussed.
More than 80 attendees from 30 member companies and institutions joined in the two-day workshop.
Led by Dr. Peter Borgesen, the advanced electronic assembly research consortium, formerly run under Universal Instruments, tackles materials and microstructure-related reliability issues critical to high-quality electronics assembly.
Members can join the consortium any time and have access to the body of knowledge amassed through its efforts during the past 15 years.
Progress reports were presented on efforts to understand the complex microstructures of Pb-free solder joints and their impact on reliability. Issues pertaining to the reliability of printed circuit materials and designs, as well as QFN and FCBGA assembly and underfilling, were also discussed.
More than 80 attendees from 30 member companies and institutions joined in the two-day workshop.
Led by Dr. Peter Borgesen, the advanced electronic assembly research consortium, formerly run under Universal Instruments, tackles materials and microstructure-related reliability issues critical to high-quality electronics assembly.
Members can join the consortium any time and have access to the body of knowledge amassed through its efforts during the past 15 years.
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