News
REDMOND, WA — Microsoft Corp. Thursday said it will take a minimum $1.05 billion charge to fix Xbox 360 consoles suffering from widespread hardware failures.
CANBY, OR – In the assembly world, putting vias directly in surface mount pads is often not recommended. But for routing large or fine-pitch BGAs, bypass capacitors, thermal management, and grounding on high-frequency parts, via-in-pad can be an effective, if demanding, solution.
BANNOCKBURN, IL – May rigid PCB shipments at North American fabricators fell 14.8%, while bookings dropped 12.2% from last year, according to the latest data from IPC.
The combined book-to-bill ratio remained just above parity at 1.01.
The combined book-to-bill ratio remained just above parity at 1.01.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing