News
ATLANTA - UP Media Group seeks abstracts for PCB Design Conference East 2007, to be held Oct. 21-26 outside Research Triangle Park, NC.
The five-day conference program focuses on PCB design, engineering and manufacturing. The conference is comprised of a three-day technical conference and a Professional Development Certificate program of one-day and two-day courses. PCB East 2007 also includes a two-day (Oct. 23-24) exhibition of top industry vendors.
Suggested presentation topics include: high speed, high frequency and signal integrity; component placement; EMI/EMC analysis; thermal analysis; lead-free processes; RF and microwave design; packaging design; mixed-signal design; area arrays; FPGA design and implementation; embedded passives and active devices; flexible circuitry; HDI design and technologies; PCB design/layout basics; component library creation and management; design for manufacture, test and assembly; design (including analog, digital and power supplies); PCB fabrication; soldering; surface finishes; industry forecasts, and business and design/supply chain issues.
For consideration, please email course title, suggested course length, short description of the target audience, 100- to 300-word abstract and speaker bio(s) to Kathy Nargi-Toth (knargitoth@upmediagroup.com) by Feb. 5.
Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology rather than on a company’s specific products.
The five-day conference program focuses on PCB design, engineering and manufacturing. The conference is comprised of a three-day technical conference and a Professional Development Certificate program of one-day and two-day courses. PCB East 2007 also includes a two-day (Oct. 23-24) exhibition of top industry vendors.
Papers and presentations of the following durations are sought for the technical conference: 30-minute paper sessions, one-hour lectures or panel sessions, two-hour workshops, and half-day (3.5 hour) seminars. Papers and presentations also are sought for a Professional Development Certificate program of in-depth, one-day and two-day technical tutorials.
Suggested presentation topics include: high speed, high frequency and signal integrity; component placement; EMI/EMC analysis; thermal analysis; lead-free processes; RF and microwave design; packaging design; mixed-signal design; area arrays; FPGA design and implementation; embedded passives and active devices; flexible circuitry; HDI design and technologies; PCB design/layout basics; component library creation and management; design for manufacture, test and assembly; design (including analog, digital and power supplies); PCB fabrication; soldering; surface finishes; industry forecasts, and business and design/supply chain issues.
For consideration, please email course title, suggested course length, short description of the target audience, 100- to 300-word abstract and speaker bio(s) to Kathy Nargi-Toth (knargitoth@upmediagroup.com) by Feb. 5.
Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology rather than on a company’s specific products.
If selected, final papers and presentations will be due in April.
ATLANTA -- Several major changes and clarifications to China’s RoHS law were made as recently as early December. In an exclusive broadcast, UP Media Group announces “China RoHS: Be Compliant by the March 1 Deadline,” featuring Michael Kirschner, president of Design Chain Associates. This 60-minute Webinar will be held Jan. 18 at 2 EDT.
The Webinar will help electronics companies understand and comply with China’s RoHS-like regulation when it goes into effect on March 1. Kirschner will describe the law and all of the implementation requirements, as well as what the March deadline actually means. He will also describe the steps OEMs must take to ensure compliance.
The Webinar will help electronics companies understand and comply with China’s RoHS-like regulation when it goes into effect on March 1. Kirschner will describe the law and all of the implementation requirements, as well as what the March deadline actually means. He will also describe the steps OEMs must take to ensure compliance.
SAN JOSE – The Semiconductor Industry Association today reported that global sales of semiconductors reached $22.7 billion in November, up 11.3% from November 2005. Sales increased 3.1% from in October.
It was the fifth straight month of record sales and the forecast remains strong. “Inventories are in line with current demand in most major product segments, and there are even signs of tight supplies in some memory products,” SIA president George Scalise said. “Global sales of semiconductors for the first 11 months of 2006 are in line with the SIA forecast of 9.4% growth for the year. 2007 is shaping up to be another good year for the industry with a forecast of 10% growth over 2006."
It was the fifth straight month of record sales and the forecast remains strong. “Inventories are in line with current demand in most major product segments, and there are even signs of tight supplies in some memory products,” SIA president George Scalise said. “Global sales of semiconductors for the first 11 months of 2006 are in line with the SIA forecast of 9.4% growth for the year. 2007 is shaping up to be another good year for the industry with a forecast of 10% growth over 2006."
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