News
EL SEGUNDO, CA – Semiconductor shipments in China will rise to $51.7 billion in 2007, up 20% from 2006, iSuppli Corp. predicted today. Shipments to China rose 15% in 2006.
ENDICOTT, NY – Endicott Interconnect Technologies has received $49 million in followup orders from the U.S. Department of Defense for electronics packaging and substrates for high-end computing.
The program includes $5 million for electronics packaging R&D, EI said.
The contract is the first of a three-phased, five-year program that uses EI as a DoD research arm for exploring high-speed electronics technologies. Phase one includes system development and preliminary PCB and substrate design, along with fabrication of test vehicles for evaluating alternative material sets.
Phases two and three will address processing equipment for advanced technology, PCBs, substrates and assembly.
EI anticipates this will stimulate the recruitment of scientists and engineers to produce and deliver future technologies.
The program includes $5 million for electronics packaging R&D, EI said.
The contract is the first of a three-phased, five-year program that uses EI as a DoD research arm for exploring high-speed electronics technologies. Phase one includes system development and preliminary PCB and substrate design, along with fabrication of test vehicles for evaluating alternative material sets.
Phases two and three will address processing equipment for advanced technology, PCBs, substrates and assembly.
EI anticipates this will stimulate the recruitment of scientists and engineers to produce and deliver future technologies.
ATLANTA – Manufacturers perplexed about which type of selective soldering process to use might find helpful the results of a recent survey by Stone Mountain Tool.
The survey responses revealed valuable information about different types of selective soldering machines; criteria to consider when choosing the right machine to fit a company’s goals, including advantages and disadvantages of each; cycle times, startup costs and more.
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