Circuits Assembly Online Magazine - Current Issue

News

TOKYO – JPCA 2007, held amid a minor slowdown in the electronics interconnect industry, must be considered an unqualified success. Between the innovations on display, the incorporation of the Protec assembly show, and real world collaboration, JPCA demonstrated the possibilities of realizing technical advances, and building the foundations for growth while maintaining profitability.

TUMKUR, INDIA -- Incap Corp. has signed an agreement to acquire TVS Electronics Ltd.'s contract manufacturing operations in Tumkur in a deal worth some $10 million.

The deal includes TVS's design services in Bangalore, which will be transferred to Incap Contract Manufacturing Services Pvt. Ltd.

The publicly traded, Oulu, Finland-based Incap had sales of $121 million in 2006 and employs 550 workers. TVS's

FRANKLIN, MA – On July 19, Speedline will offer a free Webcast on stencil printing solder paste for the formation of solder bumps.

This Webinar will review all aspects of the bump printing process including stencil design, solder paste selection, fixturing and printing parameters. In addition, optimization of the related reflow soldering process will be discussed.

The one-hour presentation will start at 11:00 am EST.

To register, go to www.speedlinetech.com/seminars.