News
SPOKANE VALLEY, WA – ACE Production Technologies has acquired all Drop-Jet Spray Head technology and its related products from Castle Controls & Automation.
ACE will offer the flux head as an option on its selective soldering products, and will announce standalone and inline fluxing products in the coming months.
No other terms of the agreement were disclosed.
ACE will offer the flux head as an option on its selective soldering products, and will announce standalone and inline fluxing products in the coming months.
No other terms of the agreement were disclosed.
COLORADO SPRINGS, CO – A top stencil manufacturer has devised a process for eliminating wave soldering.
A recent paper authored by Photo Stencil vice president of technology Dr. Bill Coleman outlines a procedure called intrusive reflow, said to improve Pb-free material printing.
One objective of the study was to maximize the amount of solder paste printed into the through-hole. With proper squeegee speed and squeegee angle, 100% hole fill was achieved for 0.063"-thick boards and 85% hole fill for 0.093" -thick boards with a 0.006"-thick stencil. This reportedly resulted in good top and bottom fillets and continuous solder fill around the pins with a 0.006"-thick stencil for 0.063" and 0.093"-thick boards for resistors, DIPs and four-row header arrays.
X-rays of paste hole fill and cross-sections of through-hole pins after reflow are shown in the paper. To download the paper, visit www.photostencil.com/techpapers.htm.
A recent paper authored by Photo Stencil vice president of technology Dr. Bill Coleman outlines a procedure called intrusive reflow, said to improve Pb-free material printing.
One objective of the study was to maximize the amount of solder paste printed into the through-hole. With proper squeegee speed and squeegee angle, 100% hole fill was achieved for 0.063"-thick boards and 85% hole fill for 0.093" -thick boards with a 0.006"-thick stencil. This reportedly resulted in good top and bottom fillets and continuous solder fill around the pins with a 0.006"-thick stencil for 0.063" and 0.093"-thick boards for resistors, DIPs and four-row header arrays.
X-rays of paste hole fill and cross-sections of through-hole pins after reflow are shown in the paper. To download the paper, visit www.photostencil.com/techpapers.htm.
STAMFORD, CT – Gartner Inc. cut its 2007 worldwide semiconductor forecast to $269.2 billion, a mere 2.5% increase from 2006.
Gartner previously predicted a 2007 revenue increase of 6.4%.
The research firm attributes the negative outlook to dramatic declines in DRAM average selling prices and continued price competition in the compute MPU segment.
Gartner said first quarter semiconductor sales were more than 5% lower than in the previous quarter, which was worse than expected.
The firm said it expects the industry to return to annual growth of 8.7% and 7.2% in 2008 and 2009, respectively.
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