News
SAN JOSE – The SMTA announced plans for the 4th Annual International Wafer-Level Packaging Conference and Exhibition.
This event will be held Sept. 18-19 in San Jose, and will focus on leading-edge IC packaging and test technologies with special emphasis on 3-D stacked packaging.
The event includes one day of workshops, a two-day technical program and two days of exhibits.
Submit 200-word abstracts to Melissa Serres at melissa@smta.org by March 23.
This event will be held Sept. 18-19 in San Jose, and will focus on leading-edge IC packaging and test technologies with special emphasis on 3-D stacked packaging.
The event includes one day of workshops, a two-day technical program and two days of exhibits.
Submit 200-word abstracts to Melissa Serres at melissa@smta.org by March 23.
SONORA, MEXICO – Indium announced signed an agreement with Multi Dicona to distribute soldering materials in Sonora, Mexico.
Multi Dicona has more than 13 years’ experience in the printed circuit board industry and is working toward ISO 9000 certification.
The deal covers Indium’s solder paste, rework flux, wave solder fluxes, liquid fluxes, solder bar, solid and flux cored wire, and tape and reel preforms.
Multi Dicona has more than 13 years’ experience in the printed circuit board industry and is working toward ISO 9000 certification.
ROME, NY – The Electrostatic Discharge Association (ESDA) has conferred program manager certification status on seven individuals. The program certifies the expertise of individuals involved in designing, implementing, managing and auditing ESD control programs.
Gaining certification were Dale Fuller, Brad Klepsa, Marcus Koh, Jim Krzmarzick, Jeff Salisbury, Keith Smith and Luis Velazquez.
The test was developed and graded by the Program Manager Certification Council.
ESDA will host the first annual Device Design Certification Exam in September during the association’s 2007 EOS/ESD Symposium in Anaheim, CA. Details regarding the exam are available at www.esda.org/devicedesign.html.
Gaining certification were Dale Fuller, Brad Klepsa, Marcus Koh, Jim Krzmarzick, Jeff Salisbury, Keith Smith and Luis Velazquez.
The test was developed and graded by the Program Manager Certification Council.
ESDA will host the first annual Device Design Certification Exam in September during the association’s 2007 EOS/ESD Symposium in Anaheim, CA. Details regarding the exam are available at www.esda.org/devicedesign.html.
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