News
OXFORDSHIRE, UK – The National Physical Laboratory will hold a meeting on copper dissolution in lead-free alloys on Dec. 7 in Oxfordshire.
According to NPL, the meeting will launch a program that intends to study various lead-free alloys under different temperatures and soldering technologies. The group plans to develop a measuring method for testing alloys.
The agenda will be set by the group’s specific production needs, designs, equipment, alloys and PCB finishes. Participants will gain access to experimental results before the end of the project.
NPL wants to develop a monitoring technique to quantify the rate of copper loss as a result of immersion in a molten metal under static and dynamic conditions; investigate copper dissolution with a range of solder alloys, PCB styles and temperatures; and produce a best practice guide to include a test method for minimizing PCB copper dissolution.
Solder manufacturers, wave soldering manufacturers and end-users are expected to make up the program team.
According to NPL, the meeting will launch a program that intends to study various lead-free alloys under different temperatures and soldering technologies. The group plans to develop a measuring method for testing alloys.
The agenda will be set by the group’s specific production needs, designs, equipment, alloys and PCB finishes. Participants will gain access to experimental results before the end of the project.
NPL wants to develop a monitoring technique to quantify the rate of copper loss as a result of immersion in a molten metal under static and dynamic conditions; investigate copper dissolution with a range of solder alloys, PCB styles and temperatures; and produce a best practice guide to include a test method for minimizing PCB copper dissolution.
Solder manufacturers, wave soldering manufacturers and end-users are expected to make up the program team.
REDMOND, WA – Data I/O and Intel will offer an integrated solution to facilitate adoption and manufacturing with Intel’s flash memory devices and Data I/O’s automated programmers.
The companies will collaborate on concurrent engineering practices for cellular, consumer electronics, communications, computing and industrial applications, and will offer joint seminars and other educational forums. Data I/O will provide priority support for Intel customers, and work on technology development and licensing.
The companies will also explore collaborating on the Open NAND Flash Interface (ONFI) initiative to establish a standard interface for NAND flash memory devices.
The companies will collaborate on concurrent engineering practices for cellular, consumer electronics, communications, computing and industrial applications, and will offer joint seminars and other educational forums. Data I/O will provide priority support for Intel customers, and work on technology development and licensing.
The companies will also explore collaborating on the Open NAND Flash Interface (ONFI) initiative to establish a standard interface for NAND flash memory devices.
SAN JOSE -- Randy Furr, the CFO of Adobe Systems, resigned today, the company said in a press announcement. No reason was given for the departure, although Adobe said it was unrelated to Furr's performance or the company's financial statements.
Adobe is among the companies restating earnings due to improper dating of stock options. Adobe will restate earnings from 1997 to 2006.
Furr was president and COO of Sanmina-SCI from 1996 until he resigned October 2005.
Adobe is among the companies restating earnings due to improper dating of stock options. Adobe will restate earnings from 1997 to 2006.
Furr was president and COO of Sanmina-SCI from 1996 until he resigned October 2005.
Press Releases
- MKS Instruments Releases 2024 Environmental, Social, Governance Report
- Promex Industries and QP Technologies Implement Sales/Marketing Reorganization
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI