News
DALLAS, OR -- Printed circuit board maker TTM Technologies will shutter its
Dallas, OR, facility, and lay off about 300 workers, the company said. TTM expects to take a charge of $2.6 million for
severance in the first quarter of 2007.
Production will be moved to other company sites, primarily in Logan, UT, and Redmond, WA.
Production will be moved to other company sites, primarily in Logan, UT, and Redmond, WA.
PENANG, MALAYSIA – Pac Tech will open a high-volume wafer bumping facility in Penang next year. The 40,000 sq. ft. location will be completed in June and will be designed for mass production of wafer bumping using electroless NiAu, solder stencil printing, wafer sawing, solder-ball placement and more. The facility will reportedly be able to process 600,000 wafers annually to start. The company will begin producing in volume in October.
BRUSSELS -- The EU Commission has opened discussions for its latest round of requests for exemptions to the RoHS Directive.
A list of proposed exemptions is available here.
Among the requests: That all uses of lead in solders be exempted on the grounds that the replacements are more environmentally damaging than the leaded versions.
A list of proposed exemptions is available here.
Among the requests: That all uses of lead in solders be exempted on the grounds that the replacements are more environmentally damaging than the leaded versions.
Press Releases
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- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
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- Scanfil and Etteplan deepen their strategic partnership into production testing