MINNEAPOLIS – SMTA issued call for papers for several upcoming conferences. The SMTA conference in Shanghai, to be held in conjunction with Nepcon China, will address issues concerning electronics manufacturing, advanced packaging and Pb-free reliability. The conference will take place April 23; abstracts are due Dec. 31. For more information, visit http://smta.org/education/education.cfm#shanghai.   
 
The 2007 Medical Electronics Symposium will be held May 1-3, in Minneapolis. It will focus on the medical electronics and medical device applications. The technical committee is soliciting abstracts and papers with up-to-date information about company expertise, practices and applications. Abstracts are due Jan. 5. Submit abstracts to Melissa Serres at melissa@smta.org or visit http://smta.org/education/education.cfm#medical for more information.
 
The 3D/SiP/Advanced Packaging Symposium will be held May 9-11, in Research Triangle Park, NC. The focus will be on advanced packaging. Submit abstracts by Jan. 5. Visit http://smta.org/education/education.cfm#AP for a list of suggested topics and more information.
 
The International Conference on Soldering and Reliability will be held in Toronto in spring 2007. Submit abstracts by Jan. 18. Visit http://smta.org/education/education.cfm#toronto for more information.
 
Successful Lead-Free RoHS Strategies: Do it Right, Do it Now will take place June 20-21 in Boxborough, MA. Submissions covering case studies, successful practices, problems and solutions are welcome. Abstracts are due Jan. 19. Contact Melissa Serres at 952-920-7682 or melissa@smta.org.
 
SMTA International 2007 will be held Oct. 7 to 11, in Orlando. Submit abstracts by Feb. 16. Use the online form at http://smta.org/smtai/call_for_papers.cfm.