Circuits Assembly Online Magazine - Current Issue

News

BANNOCKBURN, IL – When it comes to lead-free readiness, North American OEMs trail their counterparts in Asia and Europe. However, barely half the Asian OEMs declared themselves “fully engaged” in lead-free assembly.

That’s according to “Report on IPC Lead-Free Preparedness Study,” released by IPC this month. The study looked at the level of lead-free implementation at 196 OEMs and 94 EMS companies worldwide. IPC did not break out the number of respondents in each region.

ROME, NY - The ESD Association requests abstracts for technical papers covering the effects of electrostatic discharge (ESD), electrical overstress (EOS) and static electricity for presentation at its 29th Annual EOS/ESD Symposium.

The symposium takes place Sept. 16-21 in Anaheim, CA.

Submissions must include a 50-word abstract and a maximum four-page summary. The deadline for abstracts is Jan. 12. The final submission deadline for the finished paper (max. 10 pages) is June 8.

Contact the ESD Association at 315-339-6937; info@esda.org; www.esda.org.

ST. LOUIS – LaBarge has received a $4.3 million order from Modular Mining Systems to build electronics assemblies used in mine information management systems. LaBarge will provide printed circuit boards and box-level assemblies for central data collection and communications used in heavy equipment. LaBarge will manufacture the assemblies at its Pittsburgh facility. Production is expected to begin this month and continue through January.