News
Taiwan -- BenQ has consolidated its Asia and Europe handset product houses in a move to speed up product launch time, according to Digitimes.
The product houses provide functions including technical product management, R&D, strategic procurement and supply chain management.
Jochen Eickholt, current head of BenQ mobile houses for Europe and Latin America and Irwin Chen, president of BenQ's wireless business unit, will jointly lead the new team, Digitimes said.
The product houses provide functions including technical product management, R&D, strategic procurement and supply chain management.
Jochen Eickholt, current head of BenQ mobile houses for Europe and Latin America and Irwin Chen, president of BenQ's wireless business unit, will jointly lead the new team, Digitimes said.
VANCOUVER -- Nam Tai Electronics has invested $30 million in the acquisition of machinery, new production lines, etc., to develop internal manufacturing operations.
To support its existing flexible printed circuit (FPC) subassembly business, the company has invested in FPC manufacturing, which involves the etching of a copper printed circuit onto a flexible plastic film and assisting customers in the design of the circuit layout.
To support its existing flexible printed circuit (FPC) subassembly business, the company has invested in FPC manufacturing, which involves the etching of a copper printed circuit onto a flexible plastic film and assisting customers in the design of the circuit layout.
San Jose -- With 116 billion ICs produced in 2005, the value of the worldwide IC packaging market was $23.1 billion in 2005, reports Electronic Trend Publications. Of this worldwide total, 37 billion ICs were assembled by contract packaging companies for a value of $9 billion.
The report predicts that the worldwide semiconductor industry will ship 193 billion ICs in 2010. At that time, the value of the IC packaging market will be $34.6 billion.
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