News
OTTOBURN, GERMANY -- Siemens Automation and Drives has acquired the die bonder activities of F&K Delvotec Bondtechnik GmbH. No financial terms were disclosed.
Siemens will integrate the business with its Electronics Assembly Systems division, which includes its Siplace placement machines.
The companies suggested that they would look at ways to integrate placement and die bonding processes.
Siemens will integrate the business with its Electronics Assembly Systems division, which includes its Siplace placement machines.
The companies suggested that they would look at ways to integrate placement and die bonding processes.
PHOENIX -- Suntron Corp.,a provider of electronics manufacturing services, on Thursday reported net income of $100,000 on revenue of $83.9 million for its fiscal fourth quarter.
Revenues rose 4.4% sequentially, in line with previous company guidance, but fell 28% year-over-year.
Revenues rose 4.4% sequentially, in line with previous company guidance, but fell 28% year-over-year.
In his blog today, Dr. Brian Toleno notes the upcoming RoHS laws in China.
http://circuitsassembly.com/blog/
http://circuitsassembly.com/blog/
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