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HERNDON, VARegistrations for iNEMI’s April 5 roadmap workshop are due March 28, the consortium said today.

The full-day meeting, co-sponsored by Fraunhofer IZM, IEEE’s CPMT (Components, Packaging and Manufacturing Technology) Society and IMAPS Europe, takes place at the ICM Congress Hall at Munich Messe. 

It coincides with SemiCon Europa, also in Munich.

The workshop will give attendees an advance review of draft chapters of the 2007 iNEMI Roadmap, including two key market segments and eight of the 19 technology and infrastructure areas covered:

Product sectors include automotive products and consumer/portable products. Technology areas include Packaging, board assembly, organic substrates, ceramic substrates, sensors, test, inspection and measurement, final assembly and environmentally conscious electronics.

Attendees' input be be incorporated in the 2007 Roadmap.

The registration fee is $200 and includes a copy of the 2007 iNEMI Roadmap CD. Registration deadline is March 28.  For information click here.

For information about SemiCon Europa, click here.

Every two years iNEMI updates its compendium of future manufacturing technology needs of the global electronics industry. The roadmap has become recognized as an important tool for defining the state of the art in electronics as well as identifying emerging and disruptive technologies. 


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SIOUX FALLS, SD – Electronic Systems Inc. recently shared lessons learned from its RoHS compliant processes at a workshop for executives and engineers.

About 70 persons from two dozen electronics companies attended the in Bloomington, MN, seminar to hear the EMS company, which has RoHS compliant products in production and pilot stages, describe everything from solder materials and profiles to supply chain management.

ESI said the seminar was meant to be a jump start for those who’ve not yet committed to a RoHS strategy. The first deadline for compliance is July 1, 2006.

According to company vice chairman Leo Reynolds, the seminar was not for “answer(ing) the unanswerable questions but rather to make our customers aware of the impending deadline and jog them into the realization that they need to be very aware of what may or may not have to do with their products and processes.”

Questions revolved around tin whiskering, preferred PWB finishes and soldering temperatures, he told Circuits Assembly. There were “a lot of questions on component availability and compliance [and] on verifying compliance, how can the EMS company ensure that every component is in fact lead-free compliant.”

“Obviously, there are as many unanswerable questions as there are solid ones in this whole RoHS issue.”

Speakers included Tony Hilvers, vice president of industry programs at IPC, who reviewed RoHS requirements and discussed issues related to managing the supply chain, processes and verification. Dave Paluck, ESI manufacturing engineering supervisor, gave an overview of the company’s soldering and assembly processes, while director of program management Steve Hillesheim explained the logistics and planning needed for an OEM to move product into compliance.
The U.S. Supreme Court is hearing arguments in a case that attorneys say stretches the boundaries of what should be patentable, Circuits Assembly's Mike Buetow reports in today's blog.

http://circuitsassembly.com/blog/

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