CLINTON, NY – More than 40 technicians and applications engineers attended Indium Corp.’ s 4th Annual Global Technical Summit in September. Attendees from Asia, Europe, Mexico, and the U.S. learned about new products, current research, and breakthrough developments, and presented case studies.
The agenda included presentations by Dr. Claudius Ferger, manager of advanced plastic packaging at IBM’s Thomas J. Watson Research Center; Indium vice president of technology Dr. Ning-Cheng Lee and senior technologist Dr. Ronald C. Lasky.
FREMONT, CA – Scientific Technologies (STI) has completed its merger with a subsidiary of Japan-based Omron Corp. STI shareholders will receive $10.67 per share in cash as a result of the merger, and STI will cease to be a publicly traded company.
As part of the merger, Omron acquired STI’s safety products group, and STI’s automation products group was sold and becomes a standalone company. The total transaction values the equity of the company at approximately $110.8 million.
MILPITAS, CA – Flex circuit manufacturer Lenthor Engineering has updated technical details in its Flexible Circuit Design Guide. The new version is available at www.lenthor.com.
The guide is intended to provide a comprehensive understanding of the use, design and fabrication of flexible and rigid-flexible printed circuit boards.