News
New Delhi, India -- Taking advantage of the emergence of India as a manufacturing hub, ELCOMP India 2006 international exhibition and conference will be held at the Pragati Maidan exhibition center in New Delhi on Sept. 5-8, 2006. The theme of the conference is “Indian Electronic Hardware & Manufacturing Services Industry: Achieving Global Competitiveness."
Last year’s inaugural exhibition reportedly featured 128 exhibitors from 10 countries, 48 speakers, 232 conference & technical seminar attendees and over 2,000 other attendees. Over 200 exhibitors are expected this year.
The event will be a platform for companies to showcase electronic components, subsystems and equipment to manufacture electronic components, assemblies and products. EMS and design/new technology development services will also be present.
For more information, visit: exhibitionsindia.com/elcomp/elcomp06.html
Last year’s inaugural exhibition reportedly featured 128 exhibitors from 10 countries, 48 speakers, 232 conference & technical seminar attendees and over 2,000 other attendees. Over 200 exhibitors are expected this year.
The event will be a platform for companies to showcase electronic components, subsystems and equipment to manufacture electronic components, assemblies and products. EMS and design/new technology development services will also be present.
For more information, visit: exhibitionsindia.com/elcomp/elcomp06.html
FRANKLIN, MA – As SMT manufacturing continues to move towards smaller components, it becomes increasingly important to meet fine pitch requirements. With 0201 chips, chip scale packages and microBGAs becoming more prevalent, process engineers must understand every aspect of the fine printing process.
Speedline Technologies will address fine pitch printing in a free, live, Web seminar on Thursday,
Dec. 15, from 11 a.m. to 12 Noon, EST.
Topics will include:
* Squeegee selection
* Solder paste evaluation
* Lead free solder paste printing
* Stencil design, including pin-in-paste
* Aperture design
* 45 degree printing
* Board support
* Fast cycle time printing
* Post-print inspection (2D and 3D)
Speedline Technologies will address fine pitch printing in a free, live, Web seminar on Thursday,
Dec. 15, from 11 a.m. to 12 Noon, EST.
Topics will include:
* Squeegee selection
* Solder paste evaluation
* Lead free solder paste printing
* Stencil design, including pin-in-paste
* Aperture design
* 45 degree printing
* Board support
* Fast cycle time printing
* Post-print inspection (2D and 3D)
For more info and to register visit: speedlinetech.com/seminars or call 1-508-541-4749.
ALAMEDA, CA – Chinese companies are moving up the value chain in product design, and their engineering teams offer customers an increasing array of technical options and product features. That’s according to a new report by Technology Forecasters Inc. (techforecasters.com).
Chinese electronics manufacturing and design (EMD) services are forecast to grow 95% from an estimated $38.3 billion in 2005 to $74.7 billion in 2010, TFI found.
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