MINNEAPOLIS -- The annual Pan Pacific Microelectronics Symposium
& Exhibit will focus on lead-free PWB finishes, 3-D integration,
lead-free package finishes and advanced flip chips.
The dual keynotes are, Prospects and Challenges of Nano-Packaging for Electronic and
Bioelectronic Systems, will be given by Rao Tummala, Ph.D., of the Georgia Institute of Technology, and Summary of New England Lead-free
Consortium Implementation Plan of High Volume Assembly of Printed
Wiring Boards, by Sammy Shina, Ph.D., of the University of Massachusetts Lowell.
The event takes place Jan. 17-19, in Hawaii and is sponsored by the SMTA.
Other sessions will cover thermo-mechanical reliability, materials
deposition, MEMS and sensor networks, and embedded and SiP packaging,
materials and process management and reliability testing and failure
analysis.
Sponsors include 3M Co., Asymtek, Dow Corning, Indium, Libra Industries and Sonoscan.
SAN JOSE -- Tessera
Technologies, a fabless chip packaging company, has entered into a definitive agreement to purchase
certain assets of Shellcase Ltd., for
$33 million in cash. The deal is pending standard closing conditions
and regulatory approvals and is expected to close in the December
quarter. Shellcase is a provider of commercial wafer-level image sensor packaging. Its technology portfolio includes
wafer-level packaging for image sensors and other devices used in cellphones that integrate digital cameras.
"Tessera is one of the world's leading technology development and
licensing companies. This, in combination with the Shellcase
technology and team, will enable us to grow the new business
substantially," said Bruce McWilliams, Tessera's chairman and chief
executive officer. "Furthermore, it solidifies our position in the
wafer-level packaging market for image sensors and MEMS devices, which
we believe to be among the semiconductor industry's fastest growing
market segments."
According to Prismark Partners, a research firm, the image sensor market is expected to grow
from approximately 520 million units in 2004 to approximately 1.3
billion units by 2009. And In-Stat forecasts the MEMS market to grow from 2.4 billion
units in 2004 to nearly 6 billion units by 2009.
HERNDON, VA -- A pair of trade groups will discuss implementation and adoption of material composition data exchange
standards at Productronica this month.
IPC and iNEMI will sponsor the meeting, scheduled for Nov. 16 from 9 to noon.