HERNDON, VA and PISCATAWAY, NJ —The International Electronics Manufacturing Initiative (iNEMI), will co-sponsor the third annual Tin Whisker Workshop with the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) and the Electronic Components and Technology Conference (ECTC). The workshop is scheduled for May 30, at ECTC in San Diego.
The workshop will provide an update on recent activities in the testing and modeling of tin whiskers. A roundtable discussion will focus on implementation of the JEDEC/IPC specifications relating to tin whiskers: JESD201, “Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes;” JEDEC/IPC joint publication JP002, “Current Tin Whiskers Theory and Mitigation Practices Guideline;” and JESD22A121, “Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes.” The workshop aims to identify strategies to assure that long lifecycle applications will not be subject to tin whisker failures.
ROCHESTER, NY - Hover-Davis Inc. has appointed Electri-Rep as its sales representative for Kansas, Missouri, Iowa and Nebraska. Electri-Rep has provided electronics manufacturing equipment and assembly materials for over 30 years in the territory.
Hover-Davis is a manufacturer of component delivery systems for the electronics assembly industry, providing feeding solutions for Fuji, Panasonic, Universal Instruments, Siemens, Assembleon, Samsung, Mydata, Juki, Yamaha, Alphasem and numerous custom automation manufacturers. The company’s products include electronic multi-pitch tape feeders, label feeders, print-on-demand label feeders, and bare die feeders.
Clinton, NY -- Dr. Ning-Cheng Lee, vice president of technology at Indium Corp., will receive the 2006 Exceptional Technical Achievement Award from the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. Dr. Lee was selected for his contributions to surface-mount technology and electronics packaging assembly.
This annual award recognizes contributions to new and important technology or products that advance the fields encompassed by the CPMT Society. The award presentation will take place on June 1, as part of the Electronics Components and Technology Conference (ECTC) in San Diego.
Dr. Lee was named SMTA Member of Distinction in 2002 and received the Soldertec Global Lead-Free Solder Award in 2003. He is also an SMTA board member, liaison to the Taiwan SMTA chapter, coordinator and chair of the 2005 Nepcon Shanghai technical program, and author of two books and over 100 technical papers.