Circuits Assembly Online Magazine - Current Issue

News

MINNEAPOLIS, MN -- The SMTA has finalized the conference program for SMTAI, held Sept. 25 - 29, in Rosemont, IL.

Technical sessions held on Tuesday and Wednesday are organized into tracks on Manufacturing and Assembly, Advanced Packaging, Substrates, RoHS and Process Control.

Full- and half-day educational courses, offered on Sunday and Monday, will focus on Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, Test/Inspection/Quality and Process Control. Of the 30 tutorials offered, 16 are entirely new and 13 will focus on lead-free and environment-friendly issues.

The Emerging Technologies Summit on Monday will feature sessions on Roadmaps, Turning Lead into Gold, Advanced Power Technology and will conclude with an Emerging Technologies panel.

The Contract Manufacturing Symposium on Tuesday will consist of paper sessions on Mid-Tier EMS Strategy and Models and Markets. The Lead-Free Symposium on Thursday will feature paper sessions on the Joint Council on Aging Aircraft (JCAA) / Joint Group on Pollution

Prevention (JCPP) Lead-free Solder Project and additional sessions on Process Implementation and Reliability.

Two workshops will be held on Thursday morning on Lead-free Reflow Soldering Using Convection Dominant Ovens and Emerging Technologies Today & Tomorrow - The Next 50 Years.

Free events include:

- The Opening Session on RoHS Compliance and Lead-free

- A presentation on iNEMI Roadmaps

- A panel discussion on environmental efforts beyond lead-free implementation

- A technical session on Process Improvement and Lean Manufacturing in PCB Assembly

- A presentation on Rapid Setup and Turnover

- A mini-conference on radio frequency identification (RFID) technology

- A panel discussion on the RoHS and WEEE directives

- A technical session on Lead-free Reflow

The Board Authority Live: Impact of Green Technologies will address the impact of environmental legislation on PCB design, fabrication and assembly. It will cover issues like lead-free and halogen-free laminate selection, tin whisker reduction, lead-free reliability data and using HDI to reduce manufacturing costs associated with RoHS and WEEE Directive compliance.

Board Talk will once again uncover the truths and myths of electronics assembly, with all proceeds being donated to the Charles Hutchins Educational Grant ($25 SMTA members/$30 non-members).

The keynote during the Annual Meeting and Luncheon on Wednesday will feature Dan Shea, CTO of Celestica, dicussing " The Impact of Temperature on Hybrid and Compliant Assemblies."

Hudson, NH -- Machine Capability Analysis (MCA) testing helps pick-and-place equipment manufacturers and users comply with the new IPC-9850 performance standard, according to Michael Sivigny, general Manager of CeTaQ Americas.

MCA testing is a third party, objective evaluation methodology in which special vision algorithms, accurate glass plates and components are utilized for independent measurement of Cp and Cpk indices on production equipment. All brands and models of SMT printers, dispensers, placement and semiconductor machines are easily validated with the methodology. The software that operates the equipment provides statistical specification-based results on machine quality performance.

The IPC-9850 document standardizes the parameters, measurement procedures and methodologies used for the specification, evaluation and continuing verification of assembly equipment characterization parameters. The ANSI-approved standard also establishes the procedures to characterize and document machine placement capability of surface mount assembly equipment while maintaining a placement-accuracy-to-placement-speed relationship.

According to Sivigny, “CeTaQ machine capability analysis lets the user know if a machine is performing to manufacturer’s performance specifications, a key element in IPC-9850 compliance. If the machine isn’t performing to specifications, the user or manufacturer can use the information generated by the evaluation to correct offsets and bring the machine to its best possible performance condition.”

ARLINGTON, VA -– The monthly order index compiled by the Electronic Components, Assemblies & Materials Association (ECA) was flat in June, perhaps signaling a traditional summer lull.

"We typically get a steadying period in the summer," said Bob Willis, ECA president. "Last year, July was flat after 11 consecutive months of order growth; this year June is flat after months of ups and downs."

Unlike 2004, which started off with a spurt of growth that receded in the second half of the year, Willis thinks the pattern this year leans to modest but sustainable growth over the second half.

The ECA represents manufacturers and producers of passive and active electronic components, component arrays and assemblies, and materials and support services. It is a sector of the Electronic Industries Alliance.