Circuits Assembly Online Magazine - Current Issue

News

Munich, Germany and Westford, MA -- Zuken was chosen as the EDA vendor representative to participate in a multinational research project that came to a close in May. Zuken was selected for its knowledge in EMC (electromagnetic compatibility) simulation and modeling.

The aim of the MESDIE (microelectronic EMC system design for high density interconnect and high frequency environments) project was to research modeling for new chip sets, dedicated HDI and package modules for applications facing EMC/noise and system integration in the telecommunications, automotive, consumer and multimedia sectors.

MEDEA, the industry-initiated pan-European program for co-operative R&D in microelectronics, headed up the three-year, multinational MESDIE project. Working with companies such as Airbus, Alcatel, Bosch, Infineon, Continental, Philips and ST-Microelectronics, the project has begun forming the basis of methods of modeling and simulation at the system design level.

Zuken helped advance technology concepts for EMC-related modeling of power ground systems for various off-chips structures, at both the HDI and board level.

MELVILLE, NY – Arrow Electronics Inc. has expanded its Component Information Services, an online toolset that provides engineering, procurement and supply chain professionals with data to research and select electronic components. The enhancements offer a richer data set for compliance with RoHS and WEEE regulations issued by the EU.

In addition to identifying RoHS and lead-free compliance status for five million parts, data elements available include expected compliance dates, manufacturing parameters and hazardous material composition data for semiconductors, electro-mechanical and passive components.

“One of the biggest challenges for manufacturers is gathering and staying current with the necessary environmental data as requirements evolve,” said Leonie Tipton, VP, Global Supply Chain Programs. “Arrow ensures that customers get the latest data --the same data used to manage our own business worldwide--conveniently accessible in one, centralized location.”

Bromont, Quebec, Canada -- Samsung Electronics Computer Co. will expand its existing Cogiscan Moisture Sensitive Device (MSD) Control system in its Suzhou, China factory.

The system reportedly prevents costly field failures; minimizes number and duration of bake cycles; automates complex procedures; and ensures compliance with J-STD-033A rules/tables and facilitate IPC/JEDEC updates.

Lee Buyung Bum, engineering manager at Samsung in Suzhou, said, “Our most important customers are pleased that we fully comply with all the guidelines of the industry standard J-STD-033A. Our facility is producing some of the most advanced notebook in the worlds. The high density forces designers to place more and more active components on both sides of the same circuit board. This has significant implications in terms of tracking the floor life of moisture-sensitive components. Some of the most sensitive components must go through the complete assembly process, including top and bottom-side assembly and reflow within 24 hours of opening their protective dry bag. In addition the upcoming transition to lead-free products will further reduce the process window associated with MSDs.”