SAN JOSE -- Worldwide
sales of semiconductors declined slightly in April to $18.2 billion, a
sequential decline of 1.2%, the Semiconductor Industry Association reported today.
April sales were up 6.9% from last year. April is traditionally a strong month
for semiconductor sales, the SIA noted.
"Two factors - a decline in DRAM prices and a lower mix of
semiconductors for cell phones - contributed to a slight decline in
worldwide semiconductor sales in April," said SIA president George
Scalise. "For much of the past year, cellphone manufacturers were
working off inventories of chips used in low-end cell phones, which
resulted in a richer mix of products shipped. Once those inventories
were depleted and normal purchasing patterns resumed, overall ASPs for
circuits for cell phones declined. Plentiful supplies of DRAMs
contributed to declining prices and a 7% sequential decline in
DRAM sales in April."
DRAMs are one of the largest
segments of the total semiconductor market.
The SIA reported that overall factory utilization declined slightly
in the first quarter to around 85% from 86% in the fourth
quarter 2004. Utilization of leading-edge capacity (defined as capable
of producing 0.16-micron and smaller geometries) increased to 94
percent from 93 percent. Capacity utilization by integrated device
manufacturers remained stable at 87 percent. Foundry utilization
continued to decline to 72% of capacity in the first quarter
from 78% in the prior quarter. Recent comments from the two
leading foundry companies, however, project an increase in foundry
capacity utilization in the third quarter.
"Despite the slight decline in April sales, the overall outlook for
the semiconductor industry remains strong," said Scalise. "Excess
inventories have been eliminated and capacity utilization remains at
reasonable levels. Energy prices appear to have stabilized, and U.S.
economic growth - an important bellwether for the semiconductor
industry -- continues to be strong.
"On the whole, worldwide
semiconductor sales continue to run ahead of our November forecast,"
Scalise said.
HERNDON, VA—The International Electronics Manufacturing Initiative (iNEMI) has released two documents to help manufacturers reduce the risk of tin whiskers in lead-free products.
The first is JEDEC standard JESD22A121, "Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," and the second is the updated "Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products," from the iNEMI Tin Whisker User Group.
The JEDEC standard provides: an industry-standard method of measuring and comparing whisker propensity for different plating or finish chemistries and processes; a consistent inspection protocol for tin whisker examination; and a standard reporting format.
IRVINE, CA -- Following the opening of its Research and Applications Center in Irvine, CA, Henkel has completed its 900 sq. m. Hemel Hempstead facility expansion in the United UK.
Long
a center of R&D for the company's line of solder products, the
facility is now also home to several other complementary Henkel
businesses, including automotive electronics, industrial and automotive
adhesives and sealants.
The addition includes
several new laboratories: an applications lab for adhesives and
sealants, a metal pre-treatment and coatings lab, analytical
laboratories, an equipment assembly area long enough for a complete
automotive vehicle and a long-term corrosion testing area.