Circuits Assembly Online Magazine - Current Issue

News

Rolling Meadows, IL- BEST Inc., in conjunction with Cookson Electronics Assembly Materials and Automated Learning Corp. (ALC), announce the launch of their "Lead Free Rework " assembly training course. This interactive multimedia learning course is designed for rework technicians, process engineers and repair depot technicians and their respective managers who are involved in the rework of lead-free electronic assemblies.

The course teaches key concepts through presentation, practice and testing of the material. Learning takes place at any time or place that is conducive for the student, with a final interactive test for certification of the concepts learned in the program. The course can be conducted over a company LAN or through the internet. Translated versions will be offered in German and Chinese.

Minneapolis, MN -- Dr. Bruce McWilliams, chairman and CEO of Tessera Technologies, will present the keynote speech at the International Wafer-Level Packaging Conference, Nov. 3-4, at the San Jose DoubleTree Hotel, CA. The keynote, "Why Wafer-Level? Its Promise and its Future", will be given at a special dinner on November 3.

He will explore the universe of semiconductors and semiconductor packaging technologies and look at the promise offered by wafer-level packaging, including "killer" applications that will propel growth and the technical hurdles that must be overcome.

Dr. McWilliams joined Tessera in 1999 as president and CEO. He became chairman in February 2002. He had previously served as president and CEO of S-Vision Inc., a silicon-chip-based display company that he co-founded. He was also a senior vice president at Flextronics International Ltd.

The event features an exhibition of suppliers to the semiconductor packaging and testing industry, and the technical program explores semiconductor packaging, including chip scale packaging, 3-D packaging, system-in-package, system-on-chip, system-on-package and wafer-level packaging.

For more info: smta.org/iwlpc/

SAN JOSE - Worldwide semiconductor manufacturing equipment billings reached $9.4 billion in the first quarter, according to the industry trade group SEMI, up 2.3% from a year ago and 6.5% sequentially. Bookings ($7.25 billion) were down 21% from a year ago and 12% from the fourth quarter.

The data, collected in concert with the Semiconductor Equipment Association of Japan, come from more than 150 equipment companies.

"The first quarter billings showed some positive momentum over the fourth quarter of last year, while worldwide bookings for semiconductor manufacturing equipment are down for the same period," said Stanley T. Myers, president and CEO of SEMI.

Billings in Korea were up significantly sequentially, Myers said.