News
FRANKLIN, MA – Speedline Technologies has been granted a patent for an analysis technique
used to quantify the amount and geometry of solder paste between printed deposits.
US Patent 6,891,967 describes a technique that uses the texture of solder paste to identify its position relative to the pad and soldermask.
US Patent 6,891,967 describes a technique that uses the texture of solder paste to identify its position relative to the pad and soldermask.
DES PLAINES, IL — Kester will hike prices on many of its fluxes, thinners and other chemical products in response to rising costs for raw
materials used in chemical products.
The move is effective Oct. 15.
The move is effective Oct. 15.
New Tripoli, PA – High demand for digital consumer and mobile applications is driving demand for high-density packages, according a recent report by The Information Network. The group projects total HDP market growth of 32% in 2005, reaching 1.5 billion units.
“High-density packages result in a smaller overall package when compared to packaged components performing the same function,” said Dr. Robert N. Castellano, president. “They are ideal for small portable devices such as cellphones, digital audio and Bluetooth-enabled products.”
The report projects 21% growth in 2006, to 1.8 billion units.
The HDP was dominated by the Communications sector in 2003, which held a 82.9% share, followed by the Consumer sector with an 11% share. These sectors are predicted to rise 76.4% and 18%, respectively, by 2008.
System-in Package (SiPs) represented 61.1% of the MCM-L market in 2003 but will grow to a 72.9% share in 2008.
“From a technical perspective there is indeed a difference between MCM, MCP and SiP in the incorporation of passive components,” added Dr. Castellano. “From a market analysis perspective, there really is no differentiation among these three terms due to the commonality of advantages, namely: small size, lower cost of ownership, enhanced electrical performance and reduced time to market.”
“High-density packages result in a smaller overall package when compared to packaged components performing the same function,” said Dr. Robert N. Castellano, president. “They are ideal for small portable devices such as cellphones, digital audio and Bluetooth-enabled products.”
The report projects 21% growth in 2006, to 1.8 billion units.
The HDP was dominated by the Communications sector in 2003, which held a 82.9% share, followed by the Consumer sector with an 11% share. These sectors are predicted to rise 76.4% and 18%, respectively, by 2008.
System-in Package (SiPs) represented 61.1% of the MCM-L market in 2003 but will grow to a 72.9% share in 2008.
“From a technical perspective there is indeed a difference between MCM, MCP and SiP in the incorporation of passive components,” added Dr. Castellano. “From a market analysis perspective, there really is no differentiation among these three terms due to the commonality of advantages, namely: small size, lower cost of ownership, enhanced electrical performance and reduced time to market.”
Press Releases
- NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Nordson Test & Inspection Expands Partnership with Distributor smartTec Nordic A/S