News
ENDICOTT, NY -- Endicott Interconnect Technologies, IBM's former manufacturing arm, has teamed with Universal Instruments Corp. to automate and
maximize production of very large, complex printed circuit cards and
assemblies.
Endicott Interconnect, which builds PCBs, assemblies and chip packages, is using Universal's Advantis Flip Chip placement system and Polaris multi-process assembly machines to fully automate production of a high-performance chip carrier for a leading military supplier.
The product has several hundred surface-mount components, several memory devices and a very large heat spreader, Endicott Interconnect said in a press statement.
"Due to the mission critical nature of the product, we require stringent accuracy along with the ability to gang pick- and-place the larger components and sophisticated parts tracking," said Raj Raj, Endicott Interconnect senior engineering manager. "In partnership with Universal, we are able to achieve an advanced and innovative solution for these unique manufacturing needs."
Endicott Interconnect, which builds PCBs, assemblies and chip packages, is using Universal's Advantis Flip Chip placement system and Polaris multi-process assembly machines to fully automate production of a high-performance chip carrier for a leading military supplier.
The product has several hundred surface-mount components, several memory devices and a very large heat spreader, Endicott Interconnect said in a press statement.
"Due to the mission critical nature of the product, we require stringent accuracy along with the ability to gang pick- and-place the larger components and sophisticated parts tracking," said Raj Raj, Endicott Interconnect senior engineering manager. "In partnership with Universal, we are able to achieve an advanced and innovative solution for these unique manufacturing needs."
WEST CHICAGO, IL -- Connectors used in instrumentation products are a $700 million market and growing, said a new research report.
Bishop & Associates says sales of connectors used in instrumentation applications will grow to over $1 billion by 2009.
The 200-page research report also notes that the instrumentation market is not moving to China, provides high profit margins and growth that exceeds industry averages.
Bishop & Associates says sales of connectors used in instrumentation applications will grow to over $1 billion by 2009.
The 200-page research report also notes that the instrumentation market is not moving to China, provides high profit margins and growth that exceeds industry averages.
MIDLAND, MI — Dow Chemical will increase prices for all
grades of epoxy resins sold in North America by $0.05/lb, the company
said today. The increases are effective Nov. 1, 2005, or as
contract terms permit.
Dow said the increase is driven by various factors, including additional increases in feedstock and energy prices, and difficulties in transporting key raw materials due to the combined impact of Hurricane Katrina and Hurricane Rita in North America.
Epoxy resins are used in laminates for printed circuit boards.
Dow said the increase is driven by various factors, including additional increases in feedstock and energy prices, and difficulties in transporting key raw materials due to the combined impact of Hurricane Katrina and Hurricane Rita in North America.
Epoxy resins are used in laminates for printed circuit boards.
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