News
OSTEC will provide customers with on-site equipment service, training, applications support and spare parts.
West Conshohocken, PA -- At the end of March, Heraeus Circuit Materials Division acquired the ultra-fine-pitch solder powder technology and business from Welco GmbH (Potsdam, Germany).
According to the companies, the continued miniaturization of electronics assemblies has resulted in a greater demand for solder pastes with very fine solder powder particles that can no longer be manufactured economically using conventional methods. Heraeus decided to acquire expertise by taking over the patented technology and production facilities for the manufacture of ultra-fine-pitch solder powders from Welco.WASHINGTON -- Manufacturing output edged down 0.1% in March, and the factory operating rate
fell to 78%, according to the latest data from the Federal Reserve. Durable goods declined 0.2%, reflecting a drop in
the output of motor vehicles and parts and in the production of nonmetallic mineral products.
Computer and
electronics products advanced 1.1% and rose at an annual rate of 22.6% in the first
quarter. Computer and peripheral
equipment rose at an annual rate of 12.7%, and the output of
semiconductors and related components advanced at an annual rate of 39%.
Although the production of communications equipment fell in March, the index increased at an
annual rate of more than 24%, the Federal Reserve said.
Press Releases
- Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri