AUSTIN -- Smart Modular Technologies has inked a deal to license module and package stacking technologies from Staktek Holdings.
Smart makes memory products; Staktek is a provider of intellectual property and services
for chip-stacking and module technologies.
Under terms of the agreement, Smart can use
Staktek's ArctiCore technology for module products, and will be licensed to offer
stacking technology for leaded and BGA packages. Financial terms were not disclosed.
San Diego —KIC, Henkel Technologies, DEK, Engent, Vitronics Soltec and OK International will co-sponsor a lead-free workshop this Thursday and Friday at DEK’s facility in Schaumburg, IL.
This
hands-on training program is designed for engineers and engineering
management, and will provide a broader knowledge of lead-free materials
interactions, and a greater understanding of the process including
advantages and limitations. A sample lead-free board will be produced
and taken away by each attendee. Engineering and technical
representatives will be available for one-on-one discussion.
The workshop will feature hands-on production floor training in the following areas: · Screen printing surface-mount adhesives and solder paste, and placement · Reflow profiling · Inspection/analytical · Rework · Wave.
For agenda and additional information: kicthermal.com/index.html. Reservations must be made in advance.
WORCESTER, MA -- Although some designs are pushing 10 Gb/s, a
handful of connector and backplane manufacturers agreed that most
designs continue to fall in the 3.125 to 6 Gb/s range.
Exhibiting at DesignCon East this week,
Tyco and FCI, among others, claimed most interest remains centered in the mid-range, despite talk of high er speed applications.