News
US Patent 6,819,004 covers an epoxy-fluxing technology that enables no-flow underfill. The methods and materials covered within the patent permit attachment of flip chips to electronics assemblies sans underfill adhesive processes.
Kester is offering licenses for the patented technology.
In a press release, Kester said the novel technology halves the number of process steps by eliminating a steps for flux residue cleaning, capillary underfill lengthy dispensing and capillary underfill post-curing.
Central to the technology is the use of epoxy that acts as a flux during the initial soldering and then acts as an adhesive during encapsulation. The soldering or fluxing operation and encapsulation have been combined into a single stage. The patent for this technology not only covers the material but also the application such that the flip chips could be attached to the substrate simultaneously with the remainder of the surface mounted devices, Kester said.
"This patent reflects Kester's dedication to continuous innovation, which is our competitive anchor. We are very pleased that Kester's invention has been recognized by the United States Patent and Trademark Office," said Brian Deram, vice president of research and development.
Kester is actively marketing several formulas that are covered by this newly issued patent under its trademarked "SE-CURE" line. Users, the company said, are indemnified from the method of use claims covered by this patent. Licensing opportunities are available, Kester said.
ORLANDO, Jan. 4 -- A subsidiary of Dover Corp. has purchased Datamax Corp., a supplier of bar code and RFID printers. Financial terms were not disclosed.
Dover is a $5 billion OEM of industrial equipment. Among its holdings is Universal Instruments.
Dover previously announced plans to expand its subsidiary structure from four to six market segments and realign its 49 operating businesses into 13 business groups.
HERNDON, VA, Jan. 3 — The National Electronics Manufacturing Initiative consortium today changed its name to the International Electronics Manufacturing Initiative, or iNEMI.
"As a member-driven organization, we evolve to meet the demands of the changing industry landscape, which means our focus is becoming more global," says Jim McElroy, executive director and CEO, in a press statement. "[W]e have chosen a new name that retains some of our hard-earned brand recognition while signaling our move to a broader geographic scope."
McElroy said the iNEMI board has consistently guided the consortium toward a more global perspective. The organization opened its membership to all North American companies in 1996 and in 2004 actively recruited international participation in several activities.
Furthermore, the 2004 iNEMI technology roadmap marked the first time the group actively recruited participation from Asia and Europe.
The consortium has also revised its bylaws amd meeting structure to incorporate companies in Asia and Europe.
Press Releases
- Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri