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PLAINVIEW, NY, Dec. 27 -- Aeroflex Inc. said today it received $13.6 million in radio test set orders from the Army, Army National Guard and the Air Force.

Beginning in May, the company will start shipping the sets over a 14-month period.

The order brings the company's military communications orders to $22 million for fiscal 2005. The company booked about $414.1 million in sales in 2004.

Areoflex makes testing and microelectronic products for the aerospace, defense and communications markets. Read more ...
MINNEAPOLIS, Dec. 23 -- SMTA International 2004 today announced the recipients of its top awards.

Chrys Shea of Cookson Electronics won for Best of Conference, Alan Donaldson, Intel Corp., won Best of Proceedings, and Lars Boettcher, Fraunhofer IZM Berlin, won Best International Paper.

The awards are chosed by attendees and recipients win $1,000.

Shea was awarded Best of Conference Paper for "Optimizing Stencil Design for Lead-free SMT Processing." The paper identifies optimized stencil aperture geometries and explores the lower spread of lead-free alloys on some alternate surface finishes. 

Donaldson's paper, "Hot Air Lead-free Rework of BGA Packages and Sockets," presents rework profiles and a process developed based on actual package reliability tests.

Boettcher's paper, "Development of 3D-Redistribution and Balling Technologies for Fabrication of Vertical Power Devices," which reveeals the development of a 3-D wafer-level redistribution process based on fully additive metal deposition.

The SMTA is seeking papers for its 2005 conference in September. Abstracts will be accepted through Feb. 7 at www.smta.org/smtai/call_for_papers.cfm.

Read more ...

METHUEN, MA, Dec. 28 -- Infineon Technologies and Parlex Corp. have struck a deal to jointly manufacture and sell substrates for secure mobile electronic identification products. The companies will set up a JV to supply substrates for Infineon's Flip Chip on Substrate program, and to outside customers.

The joint venture will be headquartered in Hong Kong with manufacturing facilities in China. Operations are expected to begin in April.

Under the terms of the agreement, Parlex will have a 51% equity share with Infineon holding the remaining share. Infineon will also pay Parlex $3 million.

Parlex's Shanghai flex circuit plant will also provide certain services which will be paid for by the JV, the companies said.

Read more ...

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