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DEK has signed an exclusive OEM partner agreement with Stork Veco, a European manufacturer of electroform stencils. The companies will develop electroformed stencils for the SMT industry and semiconductor market, including a soon-to-be released VectorGuard electroformed stencil with interchangeable foils.

 

Electroformed stencils are effective in applications with high numbers of apertures, and demand better printing characteristics than can be achieved using laser-cut or chemically etched stencils.

 

Under the agreement, DEK will take full ownership for front-end orders, enquiries and on-site reports. Stork will then manufacture the stencil, before delivering it to DEK for final assembly and delivery to the end customer. Stork will no longer sell directly to end customers. Read more ...
MUNICH, Dec. 1 -- Siemens Logistics and Assembly Systems, which has reportedly installed more placement machines than any other company, today disclosed its latest machine platform to a group of editors, including Circuits Assembly.

The Siplace X-series comes in two, three and four gantry versions and features an innovative head with 20 nozzles. Further, it reaches placement speeds of up to 20,000 components per hour, Siemens says. Designed for modularity and flexibility, it marks the equipment giant's first new platform in years.

The new machine is currently in beta testing at BMK Electronics, a contract assembler in Augsburg, and at Fujitsu Siemens. Siemens will officially roll out Siplace X in February, at Apex.

The new platform also comes with next-generation feeder modules and a new vision system.

At 2.4 by 2.5 meters, the platform footprint is the same as Siemens' previous models.

During the conference, Tilo Brandis, head of Siemens Electronic Assembly Systems, said the division grew 40% during its recently completed fiscal year 2003 -- twice the industry average. The company is on pace to ship 1286 placement machines in 2004, up more than 300 from 2003.

WEST HAVEN, CT, Dec. 3, 2004 - Enthone Inc., the specialty chemicals division of Cookson Electronics, has named Huub van Dun president, effective January 1. He will report directly to Steven Corbett, Cookson's president and CEO, and previous head of Enthone.

 

van Dun will have profit and loss responsibility for the worldwide Enthone business, and will be responsible for driving market penetration for all product groups, while focusing on research and development of new products and processes.

 

He has been with the company since 1967 and was previously VP of Enthone Europe.

Read more ...

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