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SINGAPORE, Dec. 2, 2004 - Speedline Technologies Inc. has launched a Chinese language version of their website (speedlinetech.com) as part of their expanding service to distributors, customers and manufacturers throughout Asia.

 

The new website provides information regarding  products, services and software, along with technical processes and applications information and news. It also provides opportunities for partners and customers to conduct business online. Asia-specific customer support and contact information are highlighted.

 

To view the Chinese language version, visit the site and click on the Chinese flag.

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Norcross, GA, Dec. 1, 2004 ¾ The Electronics Assembly Systems division of Siemens Logistics and Assembly Systems Inc. is providing a Lean Manufacturing course for the Americas. The first two-day course is scheduled for Jan. 26-27, 2005, in partnership with the Center for Electronics Manufacturing & Assembly (CEMA) at the Rochester Institute of Technology (RIT).

 

The course will take place at RIT's Rochester, NY, CEMA facility. The following Lean tools will be discussed: Value Stream Mapping (VSM); 5-S; Visual Controls; Standard Work; Takt; Kanban, Pull Systems and Supermarkets; Line and Cell Design; Setup Reduction, Total Productive Maintenance (TPM); Kaizen Event Training; Impact and Culture Change; and Assessment Tools.

 

The course is being offered as a result of the Siemens EA Consortium for the Advancement of Electronics Manufacturing Education (CAEME).
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BANNOCKBURN, IL, Dec. 1, 2004- The North American book-to-bill ratio for rigid and flexible boards dipped slightly to 1.05 in October, according to IPC. It had been 1.08 in September. Shipments and bookings both dropped notably from the previous month.

 

The ratio is based on data collected from rigid PCB and flexible circuit producers that participate in IPC's statistical program. The ratio is calculated by dividing the value of orders booked over the past three months by the value of sales billed. A ratio over 1.0 is considered an indicator of rising demand.

 

Separately, the ratios were 0.94 for rigid PCBs and 1.48 for flexible circuits.

 

In October, combined shipments increased 15.3% year-on-year, with bookings up 2.7%. 

PCB shipments are up 31.5% year-to-date, and bookings are up 31.4%. 

 

However, shipments and bookings are both down from September, falling 15.5% and 16.8%, respectively.

 

Year-on-year, rigid PCB shipments are up 3.3% and bookings are down 20.0%. Shipments and bookings are both up year-to-date, increasing by 21.2% and 12.6%, but are both down sequentially, decreasing 18.7% and 16.7%, respectively.

 

Flexible circuit shipments are up 48.6% and bookings are up 81.5% year-on-year. Year-to-date, flexible shipments and bookings have grown 74.4% and 103.1%.  Sequentially, flex shipments decreased 1.9% and bookings are down 17.2%.

 

Flexible circuit sales, which include some value-added services in addition to the bare flex circuits, represent about 17% of total PCB sales in IPC's survey sample.

 

In a press release, IPC cautioned that month-to-month comparisons should be made with caution as they may reflect cyclical effects.  Read more ...

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