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Oulunsalo, Finland -- Juha Hulkko has been appointed chief executive of Elektrobit Group, a Finland-based specialist in the design, life-cycle testing and production automation of electronics products.

A founder of Elektrobit Group and a major shareholder, Hulkko has acted as Chairman since 2002.

Former CEO Juha Sipilä will take over the role of Chairman.

The executive board has been further restructured, with Jukka Harju appointed as COO. He will continue his duties in mergers and acquisitions, and oversee the executive vice presidents responsible for Strategic Business Units and Logistics and Information Management. Johann Haas has been appointed executive VP, Automotive Unit. All other support functions except Human Resources will be directed by CFO Seppo Laine.

PALO ALTO, CA -- Electronics assemblers that fail to move quickly to implement a strategies for lead-free manufacturing will suffer in the bottom line, an analyst warned today.

"SMT manufacturers that are inactive with their strategies for lead-free implementation will lose market share," said Keith Robinson, industry manager for Frost & Sullivan's surface mount technology group.

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AUSTIN, TX -- A May 1 fire at ASE's Chung-Li, Taiwan facility that destroyed part of the company's assembly and test capacity and decimated its flip-chip substrate production line will heap further pressure on an already tenuous supply of laminate substrates for semiconductor packaging.

Increased demand for laminate substrates this year, coupled with the ASE fire, is expected to push prices higher for wirebond PBGA and flip-chip substrates, says a new report from research firm TechSearch International. Unless capacity is expanded over existing plans, the situation could be similar for 2006, TechSearch said in a press release.

 

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