Circuits Assembly Online Magazine - Current Issue

News

HAUPPAUGE, NY -- Jaco Electronics Inc., a distributor of electronic components, today reported third-quarter revenues of $60.5 million, down from $63.1 million last year.

For the period ended March 31 the net loss was $1.1 million, down from a profit of $129 million last year.

Sequentially quarterly revenues rose 16.5%, and the quarterly net loss fell 29%.

Jaco chairman and chief executive Joel Girsky said, "We are continuing to evolve our 
business model to strengthen our market presence while simultaneously reducing 
all nonessential costs. Our strategy is based on an ongoing focus on our
flat panel display capability, marketing efforts targeted at business in the 
U.S. and the reduction of overhead and costs without impairing our ability to support 
our customers.

During the quarter, the company reduced SG&A costs 10.3% year-on-year and 8% sequentially.

"Jaco remains focused on capturing U.S. business, and we recently expanded our quote group team" to focus on mid-level contract manufacturers," Girsky said.

Rolling Meadows, IL- BEST Inc., in conjunction with Cookson Electronics Assembly Materials and Automated Learning Corp. (ALC), announce the launch of their "Lead Free Rework " assembly training course. This interactive multimedia learning course is designed for rework technicians, process engineers and repair depot technicians and their respective managers who are involved in the rework of lead-free electronic assemblies.

The course teaches key concepts through presentation, practice and testing of the material. Learning takes place at any time or place that is conducive for the student, with a final interactive test for certification of the concepts learned in the program. The course can be conducted over a company LAN or through the internet. Translated versions will be offered in German and Chinese.

Minneapolis, MN -- Dr. Bruce McWilliams, chairman and CEO of Tessera Technologies, will present the keynote speech at the International Wafer-Level Packaging Conference, Nov. 3-4, at the San Jose DoubleTree Hotel, CA. The keynote, "Why Wafer-Level? Its Promise and its Future", will be given at a special dinner on November 3.

He will explore the universe of semiconductors and semiconductor packaging technologies and look at the promise offered by wafer-level packaging, including "killer" applications that will propel growth and the technical hurdles that must be overcome.

Dr. McWilliams joined Tessera in 1999 as president and CEO. He became chairman in February 2002. He had previously served as president and CEO of S-Vision Inc., a silicon-chip-based display company that he co-founded. He was also a senior vice president at Flextronics International Ltd.

The event features an exhibition of suppliers to the semiconductor packaging and testing industry, and the technical program explores semiconductor packaging, including chip scale packaging, 3-D packaging, system-in-package, system-on-chip, system-on-package and wafer-level packaging.

For more info: smta.org/iwlpc/