News
Cookson Electronics Assembly Materials (CEAM, Jersey City, NY) has introduced a new dulling flux technology, ALPHA EF-9301. The product is compatible with both tin/lead and lead-free processes and is designed to help manufacturers meet environmental regulations without sacrificing productivity.
Tested under real-world conditions, the flux was shown to deliver higher first pass yields, more throughputs and require less rework than competitors. It reduces bridging on connectors and bottom side components and provides superior hole filling. Additionally, it minimizes solderballing, significantly reducing board handling time. The flux creates smooth, fully dull solder joints, easing the visual inspection process. It is designed for both spray and foam applications, eliminating the need for investment in additional equipment.
CEAM has also announced the worldwide availability of ALPHA OM-338, an ultra fine lead-free solder paste. The no-clean solder paste is designed for a broad range of applications and is formulated to minimize the transition concerns from tin/lead to lead-free processes. It yields print capability performance across various board designs and is ideally suited for ultra fine feature and high throughput applications.
The paste provides voiding resistance and maximizes reflow yields across a range of thermal profiles. Full alloy coalescence can be achieved at circular dimensions as small as 0.25 mm. Use of the paste results in print consistency and rapid cycle times. It can be applied at print speeds of up to 200 mm/sec. The high performance of the solder paste increases plant efficiency, increases yield and reduces rework requirements. It meets the highest IPC voiding performance classification and is reliable, ensuring product longevity. The paste is halide-free and compatible with either nitrogen or air reflow processing.
CEAM has also introduced ALPHA Vaculoy SACX307 lead-free wave solder alloy, which will be available worldwide through Cookson's global distribution network. The alloy delivers high yield and fast throughput, while meeting the strict lead-free environmental mandates.
Its fast wetting speed delivers improved solderability, outperforming all Sn/Cu based alloys. It provides excellent drainage and minimizes bridging defects. The alloy creates strong, mechanically sound joints with long-term reliability. The solder minimizes dross generation, resulting in low process maintenance and reduced product waste.
The process window supports the use of a wide range of flux technologies.
CEAM, a Cookson Electronics company, develops, manufactures and sells materials used in the electronics assembly process. CEAM supplies a full line of solder paste, stencils, squeegee blades, stencil and printed circuit board (PCB) cleaners, bar solder, cored wire solder, wave soldering fluxes and surface-mount device adhesives.
Copyright 2004, UP Media Group. All rights reserved.
The Surface Mount Technology Association (SMTA, Minneapolis, MN) is again co-locating its annual conference, SMTA International, with the Assembly Tech Expo (ATExpo) show this fall at the in Rosemont, IL, on Sept. 26-20.
As emerging technologies help to stimulate the recovering economy, the SMTA has once again organized an Emerging Technologies Summit to address the latest trends in electronics manufacturing and assembly. The summit will consist of three paper sessions and a concluding panel discussion.
The first session, MEMS Technology Trends and Reliability, will feature papers on Qualification and Reliability for MEMS and IC Packages; Hybrid RF MEMS Circuit Packaging; and Methodology for Prognosis of Electronics and MEMS Packaging.
The next session, Emerging IC and 3-D Packaging, will feature papers on Camera Module Packaging Technology; Sub 100nm Silicon - The Impact of Next Generation IC Packaging; and Development of 3D-Redistribution and Balling Technologies for Fabrication of Vertical Power Devices.
The last session, New Materials and Processes, will feature papers on Injection-Molded Packages; Joining Technology with Low Melting Solders and Heat Resistant Adhesives; Jet Dispensing Underfills for Stacked Die Applications; and Low Cost Air Cavity Liquid Crystal Polymer (LCP) Packaging.
Moderated by Steve Greathouse of Intel Corp., the panel discussion will feature key industry participants who will respond to audience and moderator questions.
http://www.smta.org/smtai/symposium.cfm
Copyright 2004, UP Media Group. All rights reserved.
Cookson Electronics Assembly Materials (Jersey City, NJ) is launching a new ALPHA Cored Wire product series using Cookson's manufacturing methods to create consistent flux cores, assuring repeatability with a Cpk rating of 1.826. Available in 10 tin-lead and lead-free alloys, the new cored wire complies with J-STD-004, IPC-SF 818 and ISO 12224 and is offered in the following ALPHA brands: SMT Plus, Reliacore 15, Telecore Plus, Cleanline 7000, Energized Plus and Pure Core.
Cookson Electronics developed a layer winding process that ensures consistent smooth pay-out for manual and automatic solder rework. In addition, special attention was paid to packaging the new core wire line. New color-coded spools make identification of the flux chemistry easy, and thick flanges help reduce the risk of wire damage during transit. New color-coded labels also assist with product identification by flux type and alloy, and shrink-wrapping of the spools keeps the wire shiny and clean in transit and during storage.
Cookson EAM, a Cookson Electronics company, supplies a full line of solder paste, stencils, squeegee blades, stencil and printed circuit board cleaners, bar solder, cored wire solder, wave soldering fluxes and surface-mount device adhesives.
Copyright 2004, UP Media Group. All rights reserved.
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